Medium energy ion scattering (MEIS) has been used in combination with 16 O and 18 O isotope tracing to determine elemental depth distributions and elucidate oxygen transport in 2-5 nm thick HfO 2 and HfSiO x films grown by atomic layer deposition on Si(001). Both the oxygen isotope exchange rate in the dielectric as well as the interfacial silicon oxide growth rates were examined as a function of time, temperature, film stoichiometry (HfO 2 , HfSiO x and HfSiO x N y ) and crystallinity. The amount of exchanged oxygen in the oxide was found to decrease with increasing SiO 2 content. When the SiO 2 to HfO 2 ratio reaches 1:1 in HfSiO x almost full suppression of oxygen exchange is observed. The activation barrier for the SiO 2 growth at the HfO 2 /Si and HfSiO x /Si interface was found to be much lower than that in the SiO 2 /Si and SiO x N y /Si cases, which is attributed to distinctly different oxygen incorporation mechanisms.Primary route for oxygen delivery to the interface responsible for the SiO 2 growth is via exchange, however direct oxidation by molecular oxygen cannot be discounted completely. In the presence of an interfacial nitride layer the 18 O-16 O exchange is replaced by the 18 O-N exchange, which slows diffusion and reduces the oxidation rate.2