Surface delamination of polyimide using 355-nm nanosecond pulse laser

Oh, Jae-Yong; Park, D. S.; Shin, Bo Sung

doi:10.1007/s00340-013-5478-2

Cited by 4 publications

(4 citation statements)

References 13 publications

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“…In general, we believe that both mechanisms could play a role. Compared to other reported techniques [23][24][25], the delamination of polyimide films in HF-based solutions that has been implemented in this work can be considered fast, simple and effective. Our simple method can be further improved to pave the way for a large-scale production of polyimide thin films for a wide range of flexible devices.…”

Section: Resultsmentioning

confidence: 97%

Delamination of polyimide in hydrofluoric acid

Al-mashaal

Cheung

2021

Acta Polytech

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Wet etching is a critical fabrication step for the mass production of micro and nanoelectronic devices. However, when an extremely corrosive acid such as hydrofluoric (HF) acid are used during etching, an undesirable damage might occur if the device includes a material that is not compatible with the acid. Polyimide thin films can serve as sacrificial/structural layers to fabricate freestanding or flexible devices. The importance of polyimide in microelectronics is due to its relatively low stress and compatibility with standard micromachining processes. In this work, a fast delamination process of a 4-μm-thin film of polyimide from a silicon substrate has been demonstrated. The films’ detachment has been performed using a wet-based etchant of HF acid. Specifically, the effect of HF concentration on the delamination time required to detach the polyimide film from the substrate has been investigated. This study is intended to provide the information on the compatibility of using polyimide films with HF, which can help in the design and fabrication of polyimide-based devices.

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Section: Resultsmentioning

confidence: 97%

Delamination of polyimide in hydrofluoric acid

Al-mashaal

Cheung

2021

Acta Polytech

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“…Figure 2r-u show the patterns fabricated at a laser speed of 100 mm/s. Figure 2b,c show that the PI surfaces have a lot of delaminated layers [45]. As shown in Figure 2t-u, the thickness and porosity of the LIG patterns greatly decreased owing to the relatively lower dynamic fluence.…”

Section: Morphological Characterizationmentioning

confidence: 84%

“…At this laser speed, the LIG patterns showed delamination of the surface. We predicted that a relatively faster laser scanning speed would result in more photochemical ablation [45]. As shown in Figure 2l-m, the porosity appears to disappear from the LIG patterns.…”

Section: Morphological Characterizationmentioning

confidence: 89%

Laser-Induced Graphene Heater Pad for De-Icing

Lee

Cho

et al. 2021

Nanomaterials

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The replacement of electro-thermal material in heaters with lighter and easy-to-process materials has been extensively studied. In this study, we demonstrate that laser-induced graphene (LIG) patterns could be a good candidate for the electro-thermal pad. We fabricated LIG heaters with various thermal patterns on the commercial polyimide films according to laser scanning speed using an ultraviolet pulsed laser. We adopted laser direct writing (LDW) to irradiate on the substrates with computer-aided 2D CAD circuit data under ambient conditions. Our highly conductive and flexible heater was investigated by scanning electron microscopy, transmission electron microscopy, Raman spectroscopy, thermogravimetric analysis, X-ray photoelectron spectroscopy, X-ray diffraction, and Brunauer–Emmett–Teller. The influence of laser scanning speed was evaluated for electrical properties, thermal performance, and durability. Our LIG heater showed promising characteristics such as high porosity, light weight, and small thickness. Furthermore, they demonstrated a rapid response time, reaching equilibrium in less than 3 s, and achieved temperatures up to 190 °C using relatively low DC voltages of approximately 10 V. Our LIG heater can be utilized for human wearable thermal pads and ice protection for industrial applications.

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“…Moreover, the obtained hole diameters using CO 2 lasers are approximately 75~150 μm which could not be further decreased [8]. Regarding the UV nanosecond lasers, the ablation mechanism involves two aspects, the photochemical effect and the photothermal effect [9,10]. In the photochemical effect, the chemical synthesis is broken down by photons when the photon energy is higher than the bonding energy of molecules.…”

Section: Introductionmentioning

confidence: 99%

Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

Zhao

Wang

2018

Polymers

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High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 µm and inlet interconnection pitches of 0 ~ 2 µm could be successfully drilled in FPCs using ultrashort pulse laser.

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Surface delamination of polyimide using 355-nm nanosecond pulse laser

Cited by 4 publications

References 13 publications

Delamination of polyimide in hydrofluoric acid

Delamination of polyimide in hydrofluoric acid

Laser-Induced Graphene Heater Pad for De-Icing

Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

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