Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

Zhao, Wanqin; Wang, Lingzhi

doi:10.3390/polym10121390

Cited by 17 publications

(12 citation statements)

References 33 publications

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“…Besides, larger diameter and a variety of shapes holes, such as triangles, squares, diamonds, etc., have been ablated through trepanning and helical drilling with the relative movement between the laser and sample [5][6][7][8][9]. Meanwhile, a micro-deep hole produced by ultra-short laser pulsed drilling, also known as ablation, has been used to fabricate metal components for widespread applications such as nozzles for the aerospace industry [10], printing field [11], and through-holes in the photoelectronic field [12,13]. It has been paid much attention to ultrashort pulsed laser micro-hole ablation in metals.…”

Section: Introductionmentioning

confidence: 99%

Percussion Drilling Hole in Cu, Al, Ti and Ni Alloys Using Ultra-Short Pulsed Laser Ablation

et al. 2019

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Comparative study on micro-deep hole drilling by picosecond ultra-short pulse laser in four metals, including copper, aluminum alloy, titanium alloy, and nickel alloy, was presented. Destructive testing was performed to measure the depth, shape, and side-wall morphology of micro-deep holes in this study. Diameters and depths of micro-deep holes in four metals ablated using the same processing parameters were compared. The multiple thresholds of metals had been calculated. Relationships between hole dimensions and multiple thresholds (the average ablation threshold, the ablation threshold and the thermal threshold) and physical properties (for example, the heat capacity, the melting temperature, the optical penetration depth and the absorbance, etc.) of the four metals are examined. Furthermore, the surface and side-wall morphologies of the micro-deep holes in four metals were demonstrated. The influence mechanisms, especially the side-wall morphology, were discussed, such as the thresholds, conical emission, self-cleaning effect, physical properties of metals, the energy transmission, the plasma effect, thermochemical reaction, and so on.

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Section: Introductionmentioning

confidence: 99%

Percussion Drilling Hole in Cu, Al, Ti and Ni Alloys Using Ultra-Short Pulsed Laser Ablation

et al. 2019

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“…In comparison, laser processing technology is a flexible, controllable, nonpolluting, and noncontact precision processing method under atmospheric conditions. [13][14][15][16][17][18] Lasers can be used to process complex 3D structures [19][20][21] with high quality and high precision. This has emerged as a new frontier in the development of laser manufacturing technology.…”

Section: Introductionmentioning

confidence: 99%

Processing of a Large‐Scale Microporous Group on Copper Foil Current Collectors for Lithium Batteries Using Femtosecond Laser

Sun

Zhao

et al. 2020

Adv Eng Mater

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Due to the thin thickness (≈8 μm) and soft nature of copper foil current collectors, it is extremely difficult to process large‐scale micro–nano holes on their surface. In this study, trepanning drilling of a copper foil current collector with a 1030 nm femtosecond laser system is investigated with emphasis on developing the processing technology of copper foil current collectors with different entry and exit sizes while maintaining good hole quality. The effects of laser parameters on the processing quality of copper foil current collectors are comprehensively studied. The relationship between geometric morphology and processing parameters as well as the formation mechanism is fully discussed. The smallest hole taper is found at a defocusing amount of −1.8 mm. Consequently, a group of holes with 250 000 micropores is obtained on a (2 cm × 2 cm) current collector, demonstrating the high efficiency and high quality of femtosecond laser‐based processing. Half‐cells with a modified current collector operate with a more stable response than half‐cells with unmodified copper foil at cycle performance and rate performance.

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“…Laser drilling which has its comparable advantages is an outstanding method for material processing [8][9][10]. For example, it is a non-contact machining method that does not cause mechanical deformation of the sample.…”

Section: Introductionmentioning

confidence: 99%

Percussion Drilling of Deep Holes Using Picosecond Ultrashort Pulse Laser in Ni-Based Superalloy Coated with Ceramic Thermal Barrier Coatings

et al. 2020

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Ni-based superalloy with ceramic thermal barrier coatings (TBCs) is a composite material, which can be used in special environments with high temperature and high pressure such as aeroengine blade. In order to improve the cooling effect of the aeroengine, it is necessary to perform multi-size and large-area holes processing on the surface of blades. As a non-contact processing method with fast processing speed, good processing quality and almost no deformation, laser processing has been one of the important processing methods for film cooling hole processing of aeroengine blades. Percussion drilling is presented using picosecond ultrashort pulse laser in order to explore processing of deep holes in Ni-based superalloy, ceramic TBCs, and ceramic TBCs/substrate multilayer material. The effects of pulses, threshold and wavelength on hole diameter have been discussed, and the experiment on the deep hole ablation with 1064 nm wavelength has been performed. By analyzing the hole size and morphological characteristics of multiple processing parameters, the variation of hole cylindricity is obtained. A high-quality hole, without spatters around the periphery of hole entrance and without recast layer on the side-wall surface, in Ni-based superalloy coated with ceramic TBCs has been drilled. This research has potential applications to blade film cooling holes.

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Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

Cited by 17 publications

References 33 publications

Percussion Drilling Hole in Cu, Al, Ti and Ni Alloys Using Ultra-Short Pulsed Laser Ablation

Percussion Drilling Hole in Cu, Al, Ti and Ni Alloys Using Ultra-Short Pulsed Laser Ablation

Processing of a Large‐Scale Microporous Group on Copper Foil Current Collectors for Lithium Batteries Using Femtosecond Laser

Percussion Drilling of Deep Holes Using Picosecond Ultrashort Pulse Laser in Ni-Based Superalloy Coated with Ceramic Thermal Barrier Coatings

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