Surface and depth analysis based on sputtering

Sputtering: survey of observations and derived principles

“…Sequential removal of surface layers exposes the bulk of the material, allowing the generation of depth profiles (composition versus depth) by continuous elemental analysis using any of the standard surface-analysis techniques such as low-energy ion-scattering spectroscopy, X-ray photoelectron spectroscopy or Auger electron spectroscopy. An excellent review of the topic is given by Wittmaack (1991).…”

Simultaneous detection of positive and negative secondary ions

“…3 For cesium sputtering, the pre-steadystate region prior to steady state erosion is very dependent on the sample and instrument configuration. 4 If the primary ion etching is by an inert gas ion, the chemical nature of the surface layer is relatively unaltered apart from the physical effects such as ion-beam damage, preferential sputtering, enhanced diffusivity, etc., whether or not the inert gas atoms are incorporated into the matrix. 5 In this context, the use of gallium as a primary ion is very comparable to inert gas ions as secondary ion yields are not enhanced as with oxygen or cesium.…”

“…5 In this context, the use of gallium as a primary ion is very comparable to inert gas ions as secondary ion yields are not enhanced as with oxygen or cesium. 4…”