Articles you may be interested inSurface functionalization of graphenelike materials by carbon monoxide atmospheric plasma treatment for improved wetting without structural degradation J. Vac. Sci. Technol. B 30, 03D107 (2012); 10.1116/1.3695337Study on surface modification of silicon using CHF3/O2 plasma for nano-imprint lithographya) Yttrium silicate formation on silicon: Effect of silicon preoxidation and nitridation on interface reaction kinetics Effects of ion irradiation on silicon oxidation in electron cyclotron resonance argon and oxygen mixed plasma Silicon ͑100͒ surfaces were converted to a hydrophilic state with a water contact angle of Ͻ5°by treatment with a radio frequency, atmospheric pressure helium, and oxygen plasma. A 2 in. wide plasma beam, operating at 250 W, 1.0 l/min O 2 , 30 l/min He, and a source-to-sample distance of 3 Ϯ 0.1 mm, was scanned over the sample at 100Ϯ 2 mm/ s. Plasma oxidation of HF-etched silicon caused the dispersive component of the surface energy to decrease from 55.1 to 25.8 dyn/cm, whereas the polar component of the surface energy increased from 0.3 to 42.1 dyn/cm. X-ray photoelectron spectroscopy revealed that the treatment generated a monolayer of covalently bonded oxygen on the Si͑100͒ surface 0.15Ϯ 0.10 nm thick. The surface oxidation kinetics have been measured by monitoring the change in water contact angle with treatment time, and are consistent with a process that is limited by the mass transfer of ground-state oxygen atoms to the silicon surface.