1989
DOI: 10.1007/bf00572370
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Surface analytical characterization of oxide-free Si(100) wafer surfaces

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Cited by 15 publications
(5 citation statements)
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“…[27][28][29] Silicon surfaces that contain a native oxide film after storage at ambient conditions, or have been etched with HF, can be plasma treated to create a hydrophilic surface with a water contact angle less than 5°. [27][28][29] Silicon surfaces that contain a native oxide film after storage at ambient conditions, or have been etched with HF, can be plasma treated to create a hydrophilic surface with a water contact angle less than 5°.…”
Section: Discussionmentioning
confidence: 99%
“…[27][28][29] Silicon surfaces that contain a native oxide film after storage at ambient conditions, or have been etched with HF, can be plasma treated to create a hydrophilic surface with a water contact angle less than 5°. [27][28][29] Silicon surfaces that contain a native oxide film after storage at ambient conditions, or have been etched with HF, can be plasma treated to create a hydrophilic surface with a water contact angle less than 5°.…”
Section: Discussionmentioning
confidence: 99%
“…The Si 2p peak seen at ϳ99.5 eV in the reference spectrum can be decomposed into the spin-orbit-split doublet, Si 2p 3/2 and 1/2, with a peak energy difference of ϳ0.6 eV ͑vertical lines͒. [38][39][40][41] The SiO x -related peaks posses in the energy range between 102 and 104 eV. 39,40,[42][43][44][45] We can never find such an oxide-related peak in the as-prepared spectrum ͓Fig.…”
Section: Xps Measurementmentioning
confidence: 91%
“…The Si 2 p peak seen at ∼ 99 eV can be split into two peaks, Si 2 p 3/2 and 1/2, with a peak energy difference of ∼ 0.6 eV. [16][17][18][19] The peak observed at ∼ 103 eV is mainly due to silicon bonded to oxygen as in SiO 2 . 17,18,[20][21][22][23] We can easily understand from Fig.…”
Section: Xps Measurementmentioning
confidence: 99%