Surface activated bonding of Ti/Au and Ti/Pt/Au films after vacuum annealing for MEMS packaging

Matsumae, Takashi; Kurashima, Yuichi; Takagi, Hideki

doi:10.1016/j.mee.2018.05.008

Cited by 44 publications

(25 citation statements)

References 38 publications

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“…Several Au–Au bonding techniques have been investigated to achieve low-temperature bonding, including thermocompression bonding [6,7,8,9,10,11,12], atomic diffusion bonding [4,13,14], and surface activated bonding (SAB) [15,16,17,18,19]. With SAB, the surfaces to be bonded are activated by plasma pretreatment and then bonded at low temperature (<150 °C).…”

Section: Introductionmentioning

confidence: 99%

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

et al. 2019

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Au–Au surface activated bonding is promising for room-temperature bonding. The use of Ar plasma vs. O2 plasma for pretreatment was investigated for room-temperature wafer-scale Au–Au bonding using ultrathin Au films (<50 nm) in ambient air. The main difference between Ar plasma and O2 plasma is their surface activation mechanism: physical etching and chemical reaction, respectively. Destructive razor blade testing revealed that the bonding strength of samples obtained using Ar plasma treatment was higher than the strength of bulk Si (surface energy of bulk Si: 2.5 J/m2), while that of samples obtained using O2 plasma treatment was low (surface energy: 0.1–0.2 J/m2). X-ray photoelectron spectroscopy analysis revealed that a gold oxide (Au2O3) layer readily formed with O2 plasma treatment, and this layer impeded Au–Au bonding. Thermal desorption spectroscopy analysis revealed that Au2O3 thermally desorbed around 110 °C. Annealing of O2 plasma-treated samples up to 150 °C before bonding increased the bonding strength from 0.1 to 2.5 J/m2 due to Au2O3 decomposition.

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Section: Introductionmentioning

confidence: 99%

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

et al. 2019

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“…However, we found that the Au/Ti films could not form bonds after the degas annealing steps 16 , 17 because Ti oxides, which struggle to form bonds, developed on the film surface even after annealing in a vacuum. This is undesirable for vacuum packaging because the molecules on the surface (i.e., H 2 O, N 2 , and hydrocarbons) could not be removed before packaging 18 .…”

Section: Introductionmentioning

confidence: 80%

“…We have studied the ability of the Au/Pt/Ti film to form bonding and gettering films 19 , 20 . The diffusion of Ti atoms can be controlled by inserting a Pt barrier layer between the Au and Ti layers 16 , 17 . A thick Pt layer enables bonding after degassing but possibly prevents gas absorption due to the diffusion of Ti atoms 21 – 23 .…”

Section: Introductionmentioning

confidence: 99%

Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

et al. 2022

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In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.

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“…Conducting the process in a vacuum, with additional processes such as ion beam cleaning [75,87,89,170] Macroscopic and microscopic plastic deformation [11,70,77,101,144,145] Applying interlayer [47,80,137,159] Mechanical cleaning and protective coating deposition [27,34,136] Active alloying elements [75,94] with macroscopic deformation, the use of high plastic strains and surface roughness are shown to promote intermetallic bonding. Numerous mathematical models have been developed to describe the behaviour of bonding commencing with the surface roughness effects at first contact [139].…”

Section: Methods Of Bonding Promotion Referencementioning

confidence: 99%

Review of recent developments in manufacturing lightweight multi-metal gears

Politis

Lin

2021

Prod. Eng. Res. Devel.

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This paper provides a review of recent developments in the manufacturing of lightweight multi-metal components, and in particular gears. The literature has shown that significant efforts have been made in manufacturing light gears and numerous technical challenges exist when designing for and manufacturing with dissimilar metals including challenges in heating technologies, mechanical performance, processing parameters, metal compatibility and the interface layer between adjacent materials, as well as difficulties in multi-metal simulations. Whilst the scope of multi-metal manufacturing is vast, the main concentration of this study is on the main stages of multi-metal gear production, and specifically on preform production, multi-metal heating, intermetallic bonding, and modelling of essential forming parameters. The effects of each of these methods as well as the numerous approaches studied in the literature are presented, with a recommendation being made as to a processing route that may lead to a robust multi-metal gear with minimal production line modifications to conventional steel gears.

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Surface activated bonding of Ti/Au and Ti/Pt/Au films after vacuum annealing for MEMS packaging

Cited by 44 publications

References 38 publications

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

Review of recent developments in manufacturing lightweight multi-metal gears

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