2015
DOI: 10.1016/j.supflu.2015.05.021
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Supercritical CO2 reactor for wafer-scale thin film deposition: reactor concept, numerical results, and Cu depositio.

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Cited by 7 publications
(3 citation statements)
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“…A summary diagram of resistivity data as function of the crystallite size and the deposit technique is reported in Fig. 3 [5,22,23,[37][38][39][40][41][42][43]. Resistivity values for very thin films obtained by thermal evaporation [39], using electroplating [41] and electroless plating [42] are also reported.…”
Section: Electrical Resistivitymentioning
confidence: 99%
“…A summary diagram of resistivity data as function of the crystallite size and the deposit technique is reported in Fig. 3 [5,22,23,[37][38][39][40][41][42][43]. Resistivity values for very thin films obtained by thermal evaporation [39], using electroplating [41] and electroless plating [42] are also reported.…”
Section: Electrical Resistivitymentioning
confidence: 99%
“…Thin-film deposition from scCO 2 has gained particular attention as a new deposition technique for microelectronics applications. [66,175,183,[185][186][187][188][189] The method is sometimes referred to as supercritical fluid deposition (SCFD). [188,189] SCFD is similar to a single-step SFRD and is particularly useful for the fabrication of Cu interconnects of ultra large-scale integration (ULSI) devices.…”
Section: Preparation Of Metallic Thin Films Using Sccomentioning
confidence: 99%
“…Apart from this, thin films of other metals such as Au, Ni, Pt, and bimetallic thin films can be deposited using SCFD. [66,175,183,[185][186][187][188][189]…”
Section: Metallic Interconnects In Integrated Circuitsmentioning
confidence: 99%