Summary Abstract: Improved adhesion of Ni films on x‐ray damaged polytetrafluoroethylene

Wheeler, Donald R.; Pepper, Stephen V.

doi:10.1116/1.571329

Cited by 26 publications

(11 citation statements)

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“…Metalization of PTFE has been studied extensively due to its importance in microelectronic device fabrication and packing technologies. Previous metalization studies have been carried out on PTFE using Na, Ag, Cu, , Cr, , Ti, , Al, , Ni, , and Au. ,, In general, results from these studies have revealed that metalization is accompanied by defluorination of the polymeric interface and formation of a metal fluoride layer. At higher exposures a metallic overlayer is formed.…”

Section: Introductionmentioning

confidence: 99%

Iron Metalization of Fluorinated Organic Films: A Combined X-ray Photoelectron Spectroscopy and Atomic Force Microscopy Study

2000

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The evolution of the metal-organic interface during iron-mediated metalization of fluorinated organic surfaces has been studied using X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Poly-(tetrafluoroethylene) (PTFE) and a semifluorinated self-assembled monolayer (CF 3 (CF 2 ) 7 (CH 2 ) 2 SH, CF-SAM) formed on Au were used as substrates, the latter serving as a model for the interfacial region of a fluorinated polymer. Reaction of Fe with both surfaces resulted in defluorination of the organic film, production of a carbonaceous overlayer, and exclusive formation of iron(II) fluoride. A metallic iron overlayer was formed concurrently with FeF 2 during deposition on CF-SAMs and following extended iron exposures with PTFE substrates. Terminal CF 3 groups produced during metalization of PTFE are postulated to arise from a chain rearrangement reaction involving transient -C ˙Fradicals. X-ray treatment of metalized PTFE was found to represent an effective means to increase the FeF 2 content in the metal-organic interface. Ex situ AFM measurements revealed that the frictional characteristics of the surface increased during the initial stages of metalization associated with defluorination and FeF 2 formation. At higher Fe exposures the surface friction decreased as a metallic overlayer evolved.

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Section: Introductionmentioning

confidence: 99%

Iron Metalization of Fluorinated Organic Films: A Combined X-ray Photoelectron Spectroscopy and Atomic Force Microscopy Study

2000

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“…Activation of polymer surfaces prior to metal deposition has been shown to enhance metal adhesion [6][7][8][9][10][11][12]. Along with wet chemical treatment, ion bombardment *To whom correspondence should be addressed.…”

Section: Introductionmentioning

confidence: 99%

Fluoropolymer surface modification for enhanced evaporated metal adhesion

Shi¹,

Selmani²,

Martinů

et al. 1994

Journal of Adhesion Science and Technology

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Adhesion of evaporated Cu to Teflon PFA (polytetrafluoroethylene-co-perfluoroalkoxy vinyl ether) was greatly enhanced by plasma pretreatment. The efficiency of the treatment decreased in the following order: N2 > O2 > (N2 + H2) > (O2 + H2) > H2. X-ray photoelectron spectroscopy (XPS) showed the loss of fluorine and the incorporation of oxygen and nitrogen at the polymer surface. Among the gases, H2 was found to be the most efficient for fluorine elimination, and (N2 + H2) for surface functionalization. Based on this investigation, it is proposed that Cu reacts with both oxygen and nitrogen to form, respectively, Cu-O and Cu-N bonds at the interface but no reaction occurs with carbon and fluorine. While greater enhancement in polymer surface wettability and stronger interfacial reactions can account for the higher performance of N2 over O2 in improving adhesion, these effects cannot explain the lower efficiency of H2. Several possibilities are discussed, including surface cleaning, oxygen incorporation and the formation of weak boundary layers.

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“…There is considerable evidence that chemical bonding at the interface is important to metal/polymer adhesion in general, , and metal/polyimide adhesion in particular, − where metals have been deposited by evaporation or sputtering. A similar conclusion has been reached for metal/fluoropolymer systems, − although it is unclear what reaction is responsible for adhesion . For the less reactive fluoropolymers, it is usually necessary to modifiy the surface to enhance that interaction.…”

Section: Introductionmentioning

confidence: 52%

Low-Temperature Metallization of Poly(tetrafluoroethylene) and Poly(chlorotrifluoroethylene) by Chemical Vapor Deposition

Berry

Turner

1999

Chem. Mater.

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Aluminum films were deposited on poly(tetrafluoroethylene) and poly(chlorotrifluoroethylene) substrates pretreated with TiCl 4 vapor at ambient temperature for 1 h and exposed to dimethylethylamine alane vapor for 8-72 h also at ambient temperature. The films were adherent, conducting, and polycrystalline with no preferred orientation. Scanning electron micrographs showed the surfaces to be rough and porous. X-ray photoelectron spectra contained evidence of oxidized and metallic Al, as well as F, O, C, and Cl.

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Summary Abstract: Improved adhesion of Ni films on x‐ray damaged polytetrafluoroethylene

Abstract: Chemically deposited Ni on Si(111) investigated with xray standing waves

Cited by 26 publications

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Iron Metalization of Fluorinated Organic Films: A Combined X-ray Photoelectron Spectroscopy and Atomic Force Microscopy Study

Iron Metalization of Fluorinated Organic Films: A Combined X-ray Photoelectron Spectroscopy and Atomic Force Microscopy Study

Fluoropolymer surface modification for enhanced evaporated metal adhesion

Low-Temperature Metallization of Poly(tetrafluoroethylene) and Poly(chlorotrifluoroethylene) by Chemical Vapor Deposition

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