The effect of several plasma-assisted oxide removal techniques prior to metallization of p-type GaSb was investigated. Compared to conventional chemical methods, the plasmaassisted oxide removal resulted in significant improvement of the specific contact resistivities, obtained from transfer length method measurements. Very low specific contact resistivities of less than 5 × 10 -8 Ω cm 2 were observed after surface pre-treatment by H2/Ar sputter etching and low-ion-energy argon irradiation. By eliminating sample exposure to air, in-situ Ar irradiation becomes a promising technique for high performance GaSb-based semiconductor diode lasers.