Subsurface growth of Ni atoms deposited on a Cu(001) surface

Abstract

The growth of Ni deposited at room temperature on a Cu͑001͒ surface was studied by low energy electron diffraction ͑LEED͒. For ultrathin Ni films, ranging from 1 monolayer ͑ML͒ to 3 ML, subsurface Ni layers below a 1 ML thick Cu surface layer were found to give the best fit to LEED I/V ͑intensity versus beam voltage͒ characteristics. For 1 ML thick Ni film, first-principles calculation also predicted that subsurface growth of Ni film was favored energetically to overlayer growth. As the film thickness increased, however, the reliability factor became worse. This indicated that the structure gradually deviated from the ideal subsurface Ni layer below 1 ML surface Cu. The deviation was possibly caused by the increasing disorder in the atomic structure and/or in the chemical homogeneity near the surface. ͓S0163-1829͑97͒03112-3͔

Structural, electrical and magnetic properties of evaporated Ni/Cu and Ni/glass thin films

“…A lot of studies have been devoted to the physical properties of Ni thin films grown on different substrates. Several interesting features have been reported on the Ni/Cu system [2][3][4][5][6][7][8][9][10][11][12]. Ha and O'Handley, using X-ray diffraction (XRD), investigate the strain in Ni/Cu [2].…”

BuriedNi/Cu(001)Interface at the Atomic Scale

“…The analysis of low energy electron diffraction experiments [15][16][17] suffers from the very similar scattering amplitudes of Ni and Cu and from the limited penetration depth of the electrons, seriously complicating the analysis of the buried interface. Consequently, conflicting structure models have been proposed: e.g., in contrast to Müller et al [15] and Platow et al [17], Kim et al [16] propose a Cu-cap layer on top of the Ni film.…”

Formation of a bilayer ordered surface alloy Mn/Ag(001)

“…9 A LEED I/V analysis was done by employing the TENSOR LEED program. 10 Scattering phase shifts 11 up to angular momentum quantum number l equal to 6 were used, and thermal vibration effects were taken into account by a Debye-Waller factor with a Debye temperature of 440 K for Mn and 225 K for Ag.…”