The interfacial structure and extended defects in a‐plane (1120)‐oriented GaN layers are investigated using conventional and high resolution transmission electron microscopy (HRTEM). The a‐plane GaN epilayers have been grown by nitrogen rf plasma source molecular beam epitaxy (RFMBE) on r‐plane sapphire substrates, which have been nitrided either at 200 °C or at 800 °C for one hour. A thin interfacial layer of strained AlN, with an average thickness of about 1 nm, was formed during nitridation of the sapphire surface at both temperatures. The extended defects observed in the GaN layers are predominantly threading dislocations and basal stacking faults (BSFs), which originate from the GaN/sapphire interface. The threading dislocation density is slightly reduced in the film nitrided at 800 °C, as is the density of inversion domains, although stacking fault density does not appear to change with nitridation conditions. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)