2003
DOI: 10.1088/0953-2048/17/2/009
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Submicron YBa2Cu3Oxbicrystal grain boundary junctions by focused ion beam

Abstract: Submicron YBa2Cu3O7−x bicrystal grain boundary junctions have been fabricated, for the first time, by a focused ion beam process. Although such a process has always been considered detrimental to the YBa2Cu3O7−x because of gallium contamination, high quality 24° [001] tilt junctions characterized by RSJ current–voltage characteristics, ICRN products of the order of 1–4 × 104 A cm−2 at 77 K and Fraunhofer-like modulation patterns have been obtained. No significant degradation has been observed over more than … Show more

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Cited by 12 publications
(11 citation statements)
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“…1 Figure 3 shows a typical I-V characteristic at T = 77 K. The critical current densities J Cj are of the order of 10 4 A/cm 2 at T = 77 K and about 2 -5 ϫ 10 5 A/cm 2 at T = 4.2 K. 17 One important feature is the complete suppression of the critical current by applying external magnetic fields ͑inset of Fig. 3͒.…”
Section: Resultsmentioning
confidence: 99%
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“…1 Figure 3 shows a typical I-V characteristic at T = 77 K. The critical current densities J Cj are of the order of 10 4 A/cm 2 at T = 77 K and about 2 -5 ϫ 10 5 A/cm 2 at T = 4.2 K. 17 One important feature is the complete suppression of the critical current by applying external magnetic fields ͑inset of Fig. 3͒.…”
Section: Resultsmentioning
confidence: 99%
“…A more detailed description of the fabrication procedure is reported elsewhere. 17 All the experiments have been made, with very low noise electronics, in a helium cryostat shielded by 1 thick aluminum and 3 -metal shields with a residual field lower than 1 mOe. Samples have been measured both in liquid helium ͑T = 4.2 K͒ and in liquid nitrogen ͑T =77 K͒ by using a vacuum probe covered by both a superconducting lead cylinder and a cryoperm shield.…”
Section: Methodsmentioning
confidence: 99%
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“…The Au layer also prevents charging during the FIB etch and inhibits degradation of the contact area during photolithographic processes. Tracks which cross the grain boundary were patterned by standard photolithography and Ar-ion milling and then narrowed down to sub-micron dimensions using the FIB [10] to form SQUID structures [11]. Figure 1 shows the current vs voltage characteristics of a dc SQUID in the temperature range of 15 K-44 K. The Josephson current becomes almost zero at a temperature T* between 25 K and 28 K, and increases for higher temperatures.…”
Section: Hts Grain Boundary Devicesmentioning
confidence: 99%
“…However, once experiments involve quantitative measurements, micrometric grain boundary junctions do not guarantee reliable devices with repeatable properties. Considering the difficulties for fabricating sub-micron YBCO devices, only few experiments involving these type of junctions are available in the literature, see for instance [9,12,13]. Moreover, as far as we know, the literature is lacking of experiments testing the amplitude of the order parameter, which is a quantitative test.…”
mentioning
confidence: 99%