1998
DOI: 10.1016/s0167-9317(98)00094-x
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Submicrometer patterning of YBa2Cu3O7−x

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Cited by 11 publications
(9 citation statements)
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“…Already in the 1990s thin film high-T c YBa 2 Cu 3 O 7 (YBCO) sub-μm GBJs and SQUIDs have been fabricated using e-beam lithography [20,21].…”
Section: Introductionmentioning
confidence: 99%
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“…Already in the 1990s thin film high-T c YBa 2 Cu 3 O 7 (YBCO) sub-μm GBJs and SQUIDs have been fabricated using e-beam lithography [20,21].…”
Section: Introductionmentioning
confidence: 99%
“…More recently, sub-μm YBCO GBJs have also been fabricated by FIB [23], and both technologies enabled fundamental studies on transport and noise in high-T c sub-μm GBJs [22,[24][25][26]. Still, a significant degradation of j c for w 500 nm was found [20,21,23], and the use of deep sub-μm GBJs for the realization of nanoSQUIDs has not been explored yet. The motivation for the realization of sub-μm GBJs with widths well below 500 nm is based on the following considerations: first of all, operation in high magnetic fields in the Tesla range, as mentioned above, requires very accurate alignment of the applied magnetic field in the thin film plane in order to reduce coupling of the applied out-of-field component to the GBJ.…”
Section: Introductionmentioning
confidence: 99%
“…length and width significantly smaller than 1 ) [8]. Publication about YBCO submicron structure processing has emerged slowly, mainly based on the carbon mask technique [9], [10]. Starting from these works and others described in [11]- [13] concerning HTS HEB mixers for millimeter-wave or terahertz applications, we have developed a simple two-step process combining e-beam lithography and optical lithography.…”
Section: A Generalmentioning
confidence: 99%
“…Publications about YBCO submicron structure processing started to emerge slowly, mainly based on the carbon mask technique 12,13 . Starting from these works and others described in 14,15,16 concerning HTS HEB mixers for millimeter-wave or terahertz applications, we have developed a simple twostep process combining e-beam lithography and optical lithography.…”
Section: Device Fabricationmentioning
confidence: 99%