1995 Symposium on VLSI Technology. Digest of Technical Papers
DOI: 10.1109/vlsit.1995.520879
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Sub 0.1 μm nMOSFETs fabricated using experimental design techniques to optimise performance and minimise process sensitivity

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Cited by 5 publications
(1 citation statement)
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“…For a given process condition, regular try-and-error method cannot guarantee to achieve optimized implant conditions even with many cycle times and many wafers. DOE is a powerful method to deal with multiple response optimizations in a multi-dimensional space [1][2]. However, the number of experimental runs using classical response-surface-modeling (RSM) DOE can easily exceed 25 when number of input variables reach 4 or above, which makes it not practical for semiconductor manufacturing since one lot contains only 25 wafers.…”
Section: Introductionmentioning
confidence: 99%
“…For a given process condition, regular try-and-error method cannot guarantee to achieve optimized implant conditions even with many cycle times and many wafers. DOE is a powerful method to deal with multiple response optimizations in a multi-dimensional space [1][2]. However, the number of experimental runs using classical response-surface-modeling (RSM) DOE can easily exceed 25 when number of input variables reach 4 or above, which makes it not practical for semiconductor manufacturing since one lot contains only 25 wafers.…”
Section: Introductionmentioning
confidence: 99%