Studying the cure kinetics of rubber-to-metal bonding agents using DMTA

Persson, Sture; Goude, M.; Olsson, Tomas

doi:10.1016/s0142-9418(02)00174-5

Cited by 8 publications

(2 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The oscillating strain and mechanical properties is measured when the basic function is to subject the samples. The strain normally in low value as it is always depending on material and sample geometry [4]. DMTA primarily consists of three components which play an important role.…”

Section: Introductionmentioning

confidence: 99%

Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

Durairaj

Sean

Chiun

et al. 2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

View full text Add to dashboard Cite

Isotropic conductive adhesive (ICAs) are considered as the most promising replacement to lead or lead free solders due to relatively low melting point, simple processing, low processing temperature and fine pitch capability. The study aims to instigate the dynamic mechanical and thermal properties of diglycidylether of bisphenol-A (DGEBA) and polyurethane (PU) based ICAs. Dynamic mechanical thermal analysis (DMTA) is one of the ways to estimate changes, which occur for polymeric materials in the broad range of temperature and frequency of changes in load. In this study, the results showed that measurement of storage modulus, loss modulus and also damping factor of the samples formulated with DGEBA has better thermal mechanical properties than the samples formulated with PU. In addition, by changing the conventional silver flakes to silver nanoparticles; the results shows that nanoparticles make a little improvement in thermal mechanical properties for the temperature beyond T g. For silver flake formulation with DGEBA, the result shown that the samples with higher volume fraction of silver flake shows a better thermal mechanical properties.

show abstract

Section: Introductionmentioning

confidence: 99%

Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

Durairaj

Sean

Chiun

et al. 2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

View full text Add to dashboard Cite

show abstract

“…The direct adhesion between metals and rubbers during curing has become a matter of interest for the production of different products, valve sensors, packing, and rubber vibration insulators consisting of combinations of metals and vulcanizates). The function of rubber-to-metal bonded products is thus to a great extent dictated by the strength and durability of the interfacial bonds [2,3]. A lot of knowledge is also available concerning the pre-treatment of the (metal) substrates [4].…”

Section: Introductionmentioning

confidence: 99%

Curing Characteristics and Dynamic Mechanical Behaviour of Reinforced Acrylonitrile-Butadiene/Chlorosulfonated Polyethylene Rubber Blends

Marković¹,

Marinović‐Cincović²,

Valentová

et al. 2005

MSF

View full text Add to dashboard Cite

This paper deals with the control of the adhesion strength in metal-elastomer joints by fillers and the use of rubber blends to produce advanced high performance adhesive systems. The curing behavior of rubber compounds and dynamic mechanical properties of crosslinked rubber composites were considered in this technologically applicable study. The effects of two types of reinforcing filler, used to increase the adhesion strength between steel and rubber matrix based on acrylonitrile-butadiene rubber (NBR) and chlorosulfonated polyethylene rubber (CSM) was investigated. Precipitated silica (with the average size of primary particle 15 nm) and diatomaceous earth (with the average size of primary particle 28 µm) were used for both rubber and its blend (NBR/CSM). The filler loading range was from 0 to 35 phr. The determination of curing characteristics was estimated by Monsanto Rheometer. The crosslink density of the rubber composites was determined by swelling measurement. Dynamic mechanical behavior was measured by mechanical spectroscopy (in a single cantilever bending mode).

show abstract

Principles and Applications of Thermal Analysis

Gabbott¹

2008

277

View full text Add to dashboard Cite

Studying the cure kinetics of rubber-to-metal bonding agents using DMTA

Cited by 8 publications

References 0 publications

Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

Curing Characteristics and Dynamic Mechanical Behaviour of Reinforced Acrylonitrile-Butadiene/Chlorosulfonated Polyethylene Rubber Blends

Principles and Applications of Thermal Analysis

Contact Info

Product

Resources

About