Study on thermal crosslinking reaction of o-naphthoquinone diazides and application to electrodeposition positive photoresist

Miyagawa, Kenji; Naruse, Keisuke; Ohnishi, Shinsuke; Yamaguchi, Koji; Seko, Kenji; Numa, Nobushige; Iwasawa, Naozumi

doi:10.1016/s0300-9440(01)00155-2

Cited by 10 publications

(10 citation statements)

References 5 publications

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“…They also found that the gel fraction (the degree of cross-linking) increased with the post-exposure baking temperature ( Fig. 8; [14]). …”

Section: Thermal Cross-linking In Positive Tone Resistsmentioning

confidence: 83%

“…That means that the unexposed resist is hardened twice, which makes the resist difficult to dissolve. Miyagawa et al [14] also presented work on thermal cross-linking of positive tone photoresist with o-naphthoquinone diazide (NQD). They mentioned that in the polymer matrix the thermal reaction of multifunctional NQD compound with copolymers with hydroxyl groups yielded sufficiently cross-linked structures at high temperatures around 140 • C for 10 min.…”

Section: Thermal Cross-linking In Positive Tone Resistsmentioning

confidence: 99%

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Tuning of resist slope with hard-baking parameters and release methods of extra hard photoresist for RF MEMS switches

Saha

Sagberg

Poppe

et al. 2008

Sensors and Actuators A: Physical

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“…They also found that the gel fraction (the degree of cross-linking) increased with the post-exposure baking temperature ( Fig. 8; [14]). …”

Section: Thermal Cross-linking In Positive Tone Resistsmentioning

confidence: 83%

Section: Thermal Cross-linking In Positive Tone Resistsmentioning

confidence: 99%

Tuning of resist slope with hard-baking parameters and release methods of extra hard photoresist for RF MEMS switches

Saha

Sagberg

Poppe

et al. 2008

Sensors and Actuators A: Physical

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“…This reaction was also monitored from an infrared spectral change at the stretching band based on the diazo groups in DNQ (2115 cm 11 ) as shown in figure 7, showing good agreement with the UV-VIS spectral change. Thus, we determined the minimum irradiation energy for positive-tone patterning as 1000 mJ cm 12 . Figure 8 exhibits the sensitivity curves of PSPI-5 film as a function of DNQ content (9.09, 16.6 and 23.1 wt%).…”

Section: Photosensitivitymentioning

confidence: 99%

Organo-Soluble Low CTE Polyimides and their Applications to Photosensitive Cover Layer Materials in Flexible Printed Circuit Boards

Ishii¹,

Akamatsu

2008

High Performance Polymers

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A novel cover layer material for flexible printed circuit (FPC) applications was developed in this work. A high molecular weight of polyimide composed of four monomers, pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 2,2'-bis(trifluoromethyl)benzidine (TFMB) and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BisApAf) was prepared by the onepot polycondensation in N-methyl-2-pyrrolidone (NMP) without precipitation and gelation. The polyimide (PI) was highly soluble in various common organic solvents. Interestingly, the PI film formed by simple solution-casting of the PI solution had a low CTE value close to that of copper foil, therefore almost no curling of the PI/copper laminate was observed when the PI film was directly formed on a copper foil. The PI film also exhibited other combined properties, including a low CTE, a high T g , high thermal stability, low water absorption, comparatively good transparency, the highest levels of non-flammability, good insulation properties and sufficient film flexibility. In addition, fine positive-tone patterns could be obtained from DNQ-containing PI with a sensitivity of 238 mJ cm 12 . The results revealed that the present PI system is a promising candidate as a novel cover layer material.

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“…aqueous tetra-ammonium hydroxide. Plus, the diazoketone derivatives inhibit the solubility of the phenolic resin in unexposed area [40, [45][46][47].…”

Section: Micromodel Fabrication Using Ma_p 1275hvmentioning

confidence: 99%

Interface physics in microporous media : LDRD final report.

Yaklin¹,

Knutson²,

Noble³

et al. 2008

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This document contains a summary of the work performed under the LDRD project entitled "Interface Physics in Microporous Media". The presence of fluid-fluid interfaces, which can carry non-zero stresses, distinguishes multiphase flows from more readily understood single-phase flows. In this work the physics active at these interfaces has been examined via a combined experimental and computational approach. One of the major difficulties of examining true microporous systems of the type found in filters, membranes, geologic media, etc. is the geometric uncertainty. To help facilitate the examination of transport at the pore-scale without this 4 complication, a significant effort has been made in the area of fabrication of both two-dimensional and three-dimensional micromodels. Using these micromodels, multiphase flow experiments have been performed for liquid-liquid and liquid-gas systems. Laser scanning confocal microscopy has been utilized to provide high resolution, three-dimensional reconstructions as well as time resolved, twodimensional reconstructions. Computational work has focused on extending lattice Boltzmann (LB) and finite element methods for probing the interface physics at the pore scale. A new LB technique has been developed that provides over 100x speed up for steady flows in complex geometries. A new LB model has been developed that allows for arbitrary density ratios, which has been a significant obstacle in applying LB to air-water flows. A new reduced order model has been developed and implemented in finite element code for examining non-equilibrium wetting in microchannel systems.These advances will enhance Sandia's ability to quantitatively probe the rich interfacial physics present in microporous systems. 5 ACKNOWLEDGMENTSWe would like to acknowledge the contributions of Joanne Fredrich who proposed this project and stewarded it during her time at Sandia. We would also like to acknowledge the work of both Mike Hickner and David Holdych who contributed to this work while at Sandia. We would also like to thank Raymond O. Cote for fabricating the cartridge for the micromodels and Brian Wroblewski and David J. Saiz for performing the photolithography work. 6 7

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Study on thermal crosslinking reaction of o-naphthoquinone diazides and application to electrodeposition positive photoresist

Cited by 10 publications

References 5 publications

Tuning of resist slope with hard-baking parameters and release methods of extra hard photoresist for RF MEMS switches

Tuning of resist slope with hard-baking parameters and release methods of extra hard photoresist for RF MEMS switches

Organo-Soluble Low CTE Polyimides and their Applications to Photosensitive Cover Layer Materials in Flexible Printed Circuit Boards

Interface physics in microporous media : LDRD final report.

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