Interfacial reactions at 100 and 150°C in the Sn-20.48 at.% In-3.05 at.% Ag (Sn-20.0 wt% In-2.8 wt% Ag)/Ni couples are studied. Three unusual phenomena are observed. First, liquation is found in Sn-20.48 at.% In-3.05 at.% Ag (Sn-In-Ag)/Ni couples that are reacted at 150°C, which is lower than the melting points of both the solder and the Ni substrate. In addition to the Ni 3 Sn 4 phase, liquid phase is formed in the reaction layer. Second, the liquid phase disappears and isothermal solidification occurs when there is prolonged isothermal heat treatment at 150°C. The results are similar to those for transient liquid phase bonding. Third, the thickness of the reaction layer in Sn-In-Ag/Ni couples that are reacted for 1440 h at 150°C is 40 times thicker than that of those reacted at 100°C. The reaction mechanisms for these three unusual phenomena: liquation, isothermal solidification, and an extraordinary increase in the reaction rate for only 50°C difference in temperature are elaborated and are related to each other.