Study on Residual Stress Evolution Mechanism and Influencing Factors of 316L/Q235B Composite Plate during Solution Heat Treatment

Abstract

In this study, the formation and evolution mechanism of residual stress in the process of solution heat treatment of a 316L/Q235B composite plate and the influence law of different factors on residual stress were analyzed by combining experiments and simulation. The results showed that the bending stress caused by interlayer thermal stress was the main factor that formed residual stress in the process of solution heat treatment of a 316L/Q235B composite plate. Tensile load was helpful to reduce the bending deformation of the composite plate during heat treatment, and ultimately improve the uniformity of residual stress distribution in the composite plate. With the increase in the total thickness, the interlayer thermal stress and bending stress between layers increased, and the primary and secondary relationship between them and residual stress was related to the specific thickness. The composite ratio had a great influence on the distribution of residual stress. When the composite ratio increased, the interlayer thermal stress between layers of the base layer increased, while that of the cladding layer decreased. At the same time, the bending stress increased with the increase in the composite ratio, and then affected the residual stress distribution.

Effect of Ultrasonic Treatment on Microstructure and Properties of 2000 MPa Ultra-High-Strength Steel-Welded Joints

“…In addition, Ji Xiangyu et al [25] analyzed the formation and evolution mechanism of residual stress during the solid solution heat treatment process of 316L/Q235B composite plates and reduced the level of residual stress by improving the solid solution heat treatment process; Liu Zichen et al [26] used simulation to elucidate the impact of post weld heat treatment differences on the relief effect of residual stress; B. Shakeri et al [27] investigated the mechanism of the effect of cast iron phase transformation on residual stress under isothermal heat treatment; E. Heidari et al [28] provided the possibility of improving the mechanical properties of materials via ablation and rolling methods.…”

Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials

“…In addition, there was a preference for the fracture of edge solder joints, which was a critical finding in fail- During the welding process, the impact of temperature fluctuations on the crystal structures of electronic device materials is primarily demonstrated by the following factors: due to the large thermal expansion coefficient of the material's constituent parts, the crystal structures itself experiences residual stress and thermal deformation during device cooling contraction. This, in turn, causes mismatched thermal stress between the constituent materials, increasing the stress and strain experienced by critical nodes in the crystal structures during subsequent service, and ultimately leading to deformation [12,13]. Figure 3 illustrates problems, including solder joint cracking and fracture, caused by temperature that significantly impede the reliable and safe operation of electronic equipment.…”