Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials
Ming Chen,
Jiasheng Li,
Wei Su
et al.
Abstract:In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations. X-ray diffraction (XRD) and LXRD micro-area residual stress analyzer were employed to determine the residual strain and stress of the CBGA sample encapsulation cover and solder joints. Subsequently, the experimental data were utilized to verify the accuracy of the simul… Show more
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