Study on quasi-orthogonal machining of elastomer pad by single-point diamond tool

Chen, Chao‐Chang A.; Pham, Quoc-Phong; Li, Yiting; Li, Tzu-Hao; Hsueh, Chinh-Tang

doi:10.1007/s00170-017-1206-0

Cited by 4 publications

(2 citation statements)

References 26 publications

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“…Diamonds are simplified as points without size. Therefore, th diamonds' height differences and their penetration difference or furrow cross influenc will not be discussed here [14,15]. The Cartesian coordinate system is fixed on the pad without spinning.…”

Section: Kinematic Modelmentioning

confidence: 99%

Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing

Zheng,

Zhao,

2023

Micromachines

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As feature sizes decrease, an investigation of pad unevenness caused by pad conditioning and its influence on chemical mechanical polishing is necessary. We set up a kinematic model to predict the pad wear profile caused by only diamond disk conditioning and verify it. This model shows the influences of different kinematic parameters. To keep the pad surface planar during polishing or only conditioning, we can change the sweep mode and range of the conditioner arm. The kinematic model is suitable for the prediction of the pad wear profile without considering the influence of mechanical parameters. Furthermore, based on the pad wear profile obtained from a real industrial process, we set up a static model to preliminarily investigate the influence of pad unevenness on the pad–wafer contact stress. The pad–wafer contact status in this static model can be approximated as an instantaneous state in a dynamic model. The model shows that the existence of a retaining ring helps to improve the wafer edge profile, and that pad unevenness can cause stress concentration and increase the difficulty in multi-zone pressure control of the polishing head.

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Section: Kinematic Modelmentioning

confidence: 99%

Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing

Zheng,

Zhao,

2023

Micromachines

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“…There are also many microstructure production research studies involving ploughing microgrooves. Chaochang Chen et al machined the surface morphology of the elastomer pad using an SPDT and generated a higher quality of pad surface [ 7 ]. Quanli Zhang et al created the indentation method and used SPDT to study the surface damage mechanism of WC/Co materials.…”

Section: Introductionmentioning

confidence: 99%

Model of Ploughing Cortical Bone with Single-Point Diamond Tool

Wang

Meng

et al. 2021

Materials

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Generating topological microstructures on the surface of cortical bone to establish a suitable microenvironment can guide bone cells to achieve bone repair. Single-point diamond tools (SPDTs) have advantages in efficiency and flexibility to fabricate surface microstructures. However, the cutting force during ploughing cannot be predicted and controlled due to the special properties of cortical bone. In this paper, a novel cutting model for ploughing cortical bone using an SPDT was established, and we comprehensively considered the shear stress anisotropy of the bone material and the proportional relationship between the normal force and the tangential force. Then, the orthogonal cutting experiment was used to verify the model. The results show that the error of calculated value and the experimental data is less than 5%. The proposed model can be used to assist the fabrication of microstructures on cortical bone surface using an SPDT.

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