2012 International Conference on Optoelectronics and Microelectronics 2012
DOI: 10.1109/icoom.2012.6316218
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Study on heat sink and solder of C-Mount packaged semiconductor laser

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(3 citation statements)
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“…In this study, we calculate the thermal stress field by using similar thermal stress analysis method utilized in [14] and [16]. As most of semiconductor materials are elastoplastic, we generally assume they are thermal linear elastic before yield [20].…”
Section: Thermoelasticity Modelmentioning
confidence: 99%
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“…In this study, we calculate the thermal stress field by using similar thermal stress analysis method utilized in [14] and [16]. As most of semiconductor materials are elastoplastic, we generally assume they are thermal linear elastic before yield [20].…”
Section: Thermoelasticity Modelmentioning
confidence: 99%
“…Xi et al [14] proposed a C-Mount package semiconductor laser model and investigated the thermal characteristics of the semiconductor laser with different kinds of heat sink materials. Finally they selected optimum materials of heat sink and solder in the laser package with safe thermal stress and deformation distributions.…”
Section: Introductionmentioning
confidence: 99%
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