Study on Cu particles-enhanced SnPb composite solder

Abstract

The Sn-Pb solder is widely used in the electronics industry. With the development of surface mount technology and miniaturization of elements, mechanical properties of the solder are critical. Creep resistance and size stability of soldered joints are important for optical electronics. In the present work, Cu particles with a size of about 8 µm were added to the eutectic 63Sn-37Pb solder to improve the creep property of the soldering alloy. The contents of the Cu particles are 5 vol.% and 10 vol.% separately. The solder matrix is 63Sn37Pb particles with a normal size of 43 µm. The composite solder pastes are manufactured from a mixture of these particles with no-clean flux. Under reflow soldering, the metal particles were uniformly dispersed in the Sn-Pb alloy, and very thin intermetallic compounds were formed between the particles and matrix. To simulate practical soldering of printed circuit boards, a specially designed mini specimen with lap joint is used for the creep-rupture test. For the condition of ambient temperature, the creep-rupture lifetime of the soldered joint can be increased by one order quantitatively using the composite solder compared to the 63Sn37Pb eutectic solder. Other mechanical properties are measured also. In addition, the wetting property of the enhanced solder is good through the wettability test.

Development of high strength Sn–Cu solder using copper particles at nanolength scale

“…This can be attributed to the presence of relatively harder second phase that serves as crack nucleation sites, resulting in a decrease in FS under tensile loading condition. This observation is consistent with the findings of other researchers working in other solder materials [7,10,38,42,[45][46][47].…”

Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints

“…per cent) in the bulk of the solder joints with 100, 50, 20 and 10 μ m SOH, respectively. Yan et al (2004) studied the effect of Cu on the tensile strength of SnPb solder, and they found that adding Cu made the grain size of the solder refined and enhanced the tensile strength. Accordingly, it can be inferred that the increase of Cu concentration in the solder bulk would improve the mechanical properties of the solder bulk through solid solution and refined grains.…”

Effect of In on Corrosion Performance of Zn-15Al-5Cu-xIn Solders

“…Red copper and pure aluminum are widely used in the power, electronics, refrigeration, and other industries because of their excellent electrical conductivity, thermal conductivity, plasticity, corrosion resistance, and ease of processing. [1][2][3] However, due to the high price of copper, replacing aluminum with pure aluminum is an effective way to reduce costs. In fact, most current applications where aluminum is used to substitute copper adopt the strategy of reducing the amount of copper used in products while using aluminum as a substitute to fully utilize the advantages of copper-aluminum composites.…”