Study of the thermal conduction mechanism of nano-SiC/DGEBA/EMI-2,4 composites

Zhou, Ting; Wang, Xin; Mingyuan, GU; Liu, Xiaoheng

doi:10.1016/j.polymer.2008.08.023

Cited by 132 publications

(61 citation statements)

References 21 publications

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“…Based on our experimental results, it was concluded that the three dimensional network formed by the silane treated nano-AlN/epoxy dominates the thermal conduction mechanism, which leads to the nanocomposite with excellent thermal conductivity. Meanwhile, thermal conduction chains, the prevailing means to conduct thermal diffusion in the large-size filler/resin, are the secondary means to conduct thermal diffusion in the nanocomposites [13]. Figure 5c shows the detailed information for comparing the thermal conductivity of as received nano-AlN/epoxy/TMPTMA system and silane treated nano-AlN/epoxy/ TMPTMA system with 5 wt% AlN loading.…”

Section: Results and Discussion 31 Aln Characterizationmentioning

confidence: 99%

“…As the thermal conductivity of epoxy systems is very low (about 0.2 W/(m!K)), thermally conductive fillers are added to these composites in order to dissipate the heat generated in electronic devices [6]. Various kinds of fillers, such as metals and metal oxides [7,8], aluminum nitride (AlN) [9][10][11], boron nitride (BN) [12], and silicon carbide (SiC) [13] have been applied to prepare thermally conductive polymer composites. Among them, AlN is a nontoxic, low cost substance, readily available as high purity powder.…”

Section: Introductionmentioning

confidence: 99%

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Influence of nano-AlN particles on thermal conductivity, thermal stability and cure behavior of cycloaliphatic epoxy/trimethacrylate system

Yu¹,

Duan²,

Peng³

et al. 2011

Express Polym. Lett.

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Abstract.We have prepared a series of nano-sized aluminium nitride (nano-AlN)/cycloaliphatic epoxy/trimethacrylate (TMPTMA) systems and investigated their morphology, thermal conductivity, thermal stability and curing behavior. Experimental results show that the thermal conductivity of composites increases with the nano-AlN filler content, the maximum value is up to 0.47 W/(m!K). Incorporation of a small amount of the nano-AlN filler into the epoxy/TMPTMA system improves the thermal stability. For instance, the thermal degradation temperature at 5% weight loss of nano-AlN/ epoxy/TMPTMA system with only 1 wt% nano-AlN was improved by 8ºC over the neat epoxy/TMPTMA system. The effect of nano-AlN particles on the cure behavior of epoxy/TMPTMA systems was studied by dynamic differential scanning calorimetry. The results showed that the addition of silane treated nano-AlN particles does not change the curing reaction mechanism and silane treated nano-AlN particles could bring positive effect on the processing of composite since it needs shorter pre-cure time and lower pre-temperature, meanwhile the increase of glass transition temperature of the nanocomposite improves the heat resistance.

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Section: Results and Discussion 31 Aln Characterizationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Influence of nano-AlN particles on thermal conductivity, thermal stability and cure behavior of cycloaliphatic epoxy/trimethacrylate system

Yu¹,

Duan²,

Peng³

et al. 2011

Express Polym. Lett.

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“…#-SiC particles with average particle size of 0.75 µm and irregularly polyhedral shape were obtained from Karl Co. Ltd., China. Micrographs of the micro-SiCs and the micro-SiC/epoxy composite can be seen in our earlier works [29,30], respectively. Carboxyl-functionalized MWCNTs (COOHMWCNTs) were provided by Chengdu Organic Chemicals Co. Ltd., Chinese Academy of Sciences, and used as-received.…”

Section: Experimental 21 Materialsmentioning

confidence: 94%

Improving the thermal conductivity of epoxy resin by the addition of a mixture of graphite nanoplatelets and silicon carbide microparticles

Zhou¹,

Cheng²,

Wang³

et al. 2013

Express Polym. Lett.

110

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Graphene nanosheet (GNS), a single layer of hexagonally arrayed sp 2 -bonded carbon, has attracted increasing attention recently due to its excellent thermal, electrical and mechanical properties. However, manufacturing GNS-filled composites has been very challenging due to the difficulties in large-scale production of GNSs and their dispersion in matrices. GNSs tend to form irreversible agglomerates or even restack to form graphite through van der Waals interactions during the processing of bulk-quantity GNSs, especially in the drying process [1]. Carbon nanotube (CNT), another type of widely studied and applied high-performance carbon-based nanofiller, also has great challenges in composite applications especially due to its expensive production cost. Instead of trying to discover easier large-scale processes for GNSs or lower cost processes for CNTs, an alternative type of carbon-based nanofiller with comparable properties, which can be produced more easily and cost-effectively in large quantities, has also recently been emphasized. Abstract. In this work, an alternative type of carbon-based nanofiller, graphite nanoplatelets (GNPs) with comparable properties, easier and lower-cost production, were used to improve the thermal conductivity of an epoxy. By adding 12 wt% GNPs or 71.7 wt% silicon carbide microparticles (micro-SiCs) to epoxy, the thermal conductivity reached maxima that were respectively 6.3 and 20.7 times that of the epoxy alone. To further improve the thermal conductivity a mixture of the two fillers was utilized. The utilized GNPs are characterized by two-dimensional (2-D) structure with high aspect ratio (~447), which enables GNPs effectively act as heat conductive bridges among 3-D micro-SiCs, thus contributes considerably to the formation of a more efficient 3-D percolating network for heat flow, resulting in higher thermal conductivity with relatively lower filler contents which is important for decreasing the density, viscosity and improving the processability of composites. A thermal conductivity, 26.1 times that of epoxy, was obtained with 7 wt% GNPs + 53 wt% micro-SiCs, thus not only break the bottleneck of further improving the thermal conductivity of epoxy composites but also broaden the applications of GNPs.

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“…Micrographs of the SiC particles can be seen in our previous work. 11 The nano-SiC and micro-SiC particles are approximately spherical and irregular polyhedral in shape, respectively. SiC particles without silane treatment are seriously and unevenly agglomerated.…”

Section: Methodsmentioning

confidence: 99%

Study on Mechanical, Thermal and Electrical Characterizations of Nano-SiC/Epoxy Composites

Zhou

Wang

et al. 2009

Polym. J.

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This report covers the results of a study on evaluating the effect of nano-SiC particles on mechanical, thermal and electrical properties of epoxy by lap shear, TGA, DSC and electrical tests. Epoxy composites filled with micro-SiC particles were also studied for comparison. The mechanisms of performance improvement were discussed in detail. The results showed that with identical loading, silane treated nano-SiC filled nanocomposites have the best properties. The volume resistivity decrease, dielectric constant " increase and loss tangent tanðÞ increase by addition of silane treated nano-SiC particles are smaller than those by the other fillers. Silane treatment of nanoparticles improves each performance, including increases shear strength, thermal stability, volume resistivity and decreases " and (). The addition of nano-SiC particles remarkably improves shear strength, " and tanðÞ, while slightly enhances thermal stability of epoxy. 8 vol. % silane treated nano-SiC/epoxy composite has the highest shear strength 10.6 MPa with the maximum enhancement, 80%, over the neat resin. It also has good temperature independence of dielectric properties and enough volume resistivity, which meet the demand of some microelectronics materials.KEY WORDS: SiC/Epoxy Composites / Nanocomposites / Mechanical Properties / Thermal Properties / Dielectric Properties / Using inorganic nanofillers to produce high performance nanocomposites is attaining increasing interest. An interface interaction zone of 1 nm thick represents roughly 0.3 vol. % of microcomposites, whereas it can reach 30 vol. % of nanocomposites. 1 The contribution of interaction zone provides diverse possibilities of performance tailoring and is able to influence the performance to a much greater extent under rather low nanofiller loading. Studies have shown that the performance of polymeric materials can be improved by adding a small amount (<5 wt %) of inorganic nanofillers without compromising weight or processability of the composites.2-8 The challenges are to obtain remarkable improvements in the interfacial bonding between polymer matrix and nanofillers. Stronger interfacial bonding will impart better properties.SiC is a large band gap semiconductor (>2 eV) with good mechanical properties, high thermal stability (melting point $2800 C), high thermal conductivity ($390 W/mK), and high electric break down field ($4 Â 10 8 V/m). Such properties make SiC an attractive candidate for high temperature and high power applications in electronic industry.9 Epoxy resins also exhibit versatile applications in electrical and electronic industries, e.g., encapsulant of electrical circuits and electronic devices. Some studies involving the effect of nano-SiC particles on tensile response (stiffness and strength), 4 friction and wear, 5 curing process and curing kinetics 10 of epoxies have been conducted. Recently, developments in semiconductor and electronic packages require electrically insulating materials possessing high strength, good thermal stability, and low dielectric ...

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Study of the thermal conduction mechanism of nano-SiC/DGEBA/EMI-2,4 composites

Cited by 132 publications

References 21 publications

Influence of nano-AlN particles on thermal conductivity, thermal stability and cure behavior of cycloaliphatic epoxy/trimethacrylate system

Influence of nano-AlN particles on thermal conductivity, thermal stability and cure behavior of cycloaliphatic epoxy/trimethacrylate system

Improving the thermal conductivity of epoxy resin by the addition of a mixture of graphite nanoplatelets and silicon carbide microparticles

Study on Mechanical, Thermal and Electrical Characterizations of Nano-SiC/Epoxy Composites

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