Study of the Mechanical Strength Improvement of Wafers for EWT Solar Cells by Chemical Etching After the Drilling Process

Hermanns, Ludger M.; Cereceda, Eneko; Egusquiza, Josu Barredo; Felgueroso, G. Cueto

doi:10.4229/26theupvsec2011-2bv.2.56

26th European Photovoltaic Solar Energy Conference and Exhibition; 1589-1592 2011

DOI: 10.4229/26theupvsec2011-2bv.2.56

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Study of the Mechanical Strength Improvement of Wafers for EWT Solar Cells by Chemical Etching After the Drilling Process

Ludger M. Hermanns

Eneko Cereceda

Josu Barredo Egusquiza³

et al.

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Cited by 3 publications

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Study of the effect of different hole sizes on mechanical strength of wafers for back contact solar cells

Cereceda

Barredo²,

Gutiérrez

et al. 2012

2012 38th IEEE Photovoltaic Specialists Conference

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-Drilling process on wafers to produce EWT or MWT solar cells is a critical fabrication step, which affects on their mechanical stability. The amount of damage introduced during drilling process depends on the density of holes, their size and the chemical process applied afterwards. To quantify the relation between size of the holes and reduction of mechanical strength, several sets of wafers have been prepared, with different hole diameter. The mechanical strength of these sets has been measured by the ring on ring bending test, and the stress state in the moment of failure has been deduced by FE simulation.

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Study of the effect of different hole sizes on mechanical strength of wafers for back contact solar cells

Cereceda

Barredo²,

Gutiérrez

et al. 2012

2012 38th IEEE Photovoltaic Specialists Conference

Self Cite

View full text Add to dashboard Cite

show abstract

A simple approach for the simulations in the mechanical studies of drilled wafers

Barredo

Fraile

Alarcon³

et al. 2014

2014 IEEE 40th Photovoltaic Specialist Conference (PVSC)

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Damage Reduction of the Laser Drilling Process on Back Contact Solar Cells by Chemical Treatment

Hermanns

Fraile

Jimeno

et al. 2012

27th European Photovoltaic Solar Energy Conference and Exhibition; 832-835

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Study of the Mechanical Strength Improvement of Wafers for EWT Solar Cells by Chemical Etching After the Drilling Process

Cited by 3 publications

References 3 publications

Study of the effect of different hole sizes on mechanical strength of wafers for back contact solar cells

Study of the effect of different hole sizes on mechanical strength of wafers for back contact solar cells

A simple approach for the simulations in the mechanical studies of drilled wafers

Damage Reduction of the Laser Drilling Process on Back Contact Solar Cells by Chemical Treatment

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