2015
DOI: 10.1016/j.mssp.2015.07.011
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Study of metal assisted anisotropic chemical etching of silicon for high aspect ratio in crystalline silicon solar cells

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Cited by 12 publications
(5 citation statements)
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“…Also the material removal patterns, even for the much simpler planar silicon geometries are a matter of controversial debates. [56,61,[73][74][75][76] In fact, it appeared to us that one important aspect has been completely ignored so far in the MACE literature, namely a potential attraction of the AgNP to the silicon oxide that is forming at the AgNP/silicon interface. Since the pH value in the MACE process is larger than the isoelectric point of silica (pH iso =3.9), the Si-OH groups of this interface are partially deprotonated.…”
Section: Evolution Of Hierarchical Porosity In Macroporous Silicon By...mentioning
confidence: 99%
“…Also the material removal patterns, even for the much simpler planar silicon geometries are a matter of controversial debates. [56,61,[73][74][75][76] In fact, it appeared to us that one important aspect has been completely ignored so far in the MACE literature, namely a potential attraction of the AgNP to the silicon oxide that is forming at the AgNP/silicon interface. Since the pH value in the MACE process is larger than the isoelectric point of silica (pH iso =3.9), the Si-OH groups of this interface are partially deprotonated.…”
Section: Evolution Of Hierarchical Porosity In Macroporous Silicon By...mentioning
confidence: 99%
“…Both processes have different etching rates which depend on the material properties of the sample. The most common application of anistropic wet etching method is applied for the fabrication of crystalline materials [38,39]. The etching rate varies base on the plane of the crystalline material and the concentrations of the etchants.…”
Section: Chemical Wet Etchingmentioning
confidence: 99%
“…Alkali hydroxide etchants, ammonium hydroxide etchants, and reactive ion etching using acidic etchants are mainly used for Si wafer etching prior to solar cell fabrication [11]. Alkali etchants are anisotropic in nature whereas acidic etchants are isotropic [12]. Chemical etching is an inexpensive and easy way to implement with minimal facilities.…”
Section: Introductionmentioning
confidence: 99%