Study of intermetallic compounds (IMC) that form between indium-enriched SAC solder alloys and copper substrate

Rodrigues, Felipe Reis; Watson, J. F.; Liu, Stephen V.; Madeni, Juan C.

doi:10.1007/s40194-017-0445-x

Cited by 5 publications

(2 citation statements)

References 16 publications

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“…4wt.% of In was added into solder sample [10,11]. In also has maximum solubility inside Sn, it would suggest that In is distributed within β-Sn phase and not formed into In4Sn IMC [12]. Therefore, in this work, the In added could be too low for InSn4 to form.…”

Section: Differential Scanning Calorimetry (Dsc)mentioning

confidence: 89%

Effect of Alloying Element on Microstructure and Mechanical Properties of Sn-0.7cu Solder

Nabihah¹,

Jun²,

Sharif³

2018

IJCRSET

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Due to environment concern of lead Sn-0.7Cu eutectic solder has been successfully applied to practical production of consumer products. However, Sn-Cu has been reported to exhibit somewhat inferior mechanical properties compared to Ag containing lead free solder alloys. In this work, 1.0wt.% In and 0.1wt.% Fe had been added into Sn-0.7Cu eutectic solder. Three different solders have been fabricated by adding In and Fe into the solder, i.e., Sn.0.7Cu, Sn.0.7Cu.1.0In and Sn.0.7Cu.1.0In.0.1Fe. DSC result showed that adding indium decreases the melting point of Sn-Cu solder. The addition of In and Fe is expected to refine the β-Sn grains with fine Cu6Sn5 distributed within the eutectic colony of the bulk solder and contribute to higher solder strength. Characterization of the solder alloys focused on the bulk solder microstructure, IMC evaluation and wettability of solder alloys in reflowed and aged conditions. Reflow temperature was 270°C. Aging was done for 100, 250 and 500 hours at 150 °C and 180°C. The IMC observed for reflowed samples seem to decrease in thickness with addition of In and Fe. Isothermally aged samples on the other hand, did grow at higher rate when In and Fe was added. The IMC formed at the interface between solder and the copper substrate was identified as Cu6Sn5in reflowed samples, and both Cu6Sn5and Cu3Sn when aged. The shear strength of samples improved as In and Fe were added.

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Section: Differential Scanning Calorimetry (Dsc)mentioning

confidence: 89%

Effect of Alloying Element on Microstructure and Mechanical Properties of Sn-0.7cu Solder

Nabihah¹,

Jun²,

Sharif³

2018

IJCRSET

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“…Therefore, in addition to an in-depth understanding of metal bonding interaction between Ga and metal substrates, the interfacial interaction between In and substrates cannot be neglected. A variety of In-related IMCs have been demonstrated and enumerated in related studies, 67 including AgIn 2 , In 4 Sn, and InSn 4 . However, researchers only briefly compared the percentage of several IMCs and their influencing factors and did not reasonably combine the wettability with IMCs.…”

Section: Wetting Of Gallium-based Liquid Metalsmentioning

confidence: 99%

Interfacial interaction-induced super-wettability of gallium-based liquid metals: a review

Wang,

Xie

2024

J. Mater. Chem. A

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Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Yang,

Wu,

Zhang

et al. 2023

Weld World

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Study of intermetallic compounds (IMC) that form between indium-enriched SAC solder alloys and copper substrate

Cited by 5 publications

References 16 publications

Effect of Alloying Element on Microstructure and Mechanical Properties of Sn-0.7cu Solder

Effect of Alloying Element on Microstructure and Mechanical Properties of Sn-0.7cu Solder

Interfacial interaction-induced super-wettability of gallium-based liquid metals: a review

Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

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