1988
DOI: 10.1016/0022-0248(88)90099-1
|View full text |Cite
|
Sign up to set email alerts
|

Study of growth conditions of silicon carbide epitaxial layers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
6
0

Year Published

1989
1989
2004
2004

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 16 publications
(7 citation statements)
references
References 1 publication
0
6
0
Order By: Relevance
“…Because the rate of the chemical reaction C(s) + 2H 2 (g) → CH 4 (g) was lower than when hydrogen was used, the concentration of carbon on the film surface increased, resulting in enlargement of the ␣-SiC formation region. 16 Below 1000°C, the SiC films were composed mainly of the amorphous phase, whether the diluent gas was hydrogen or argon. Up to 1100°C, the as-deposited films exhibited similar XRD patterns, irrespective of the diluent gas used.…”
Section: Resultsmentioning
confidence: 99%
“…Because the rate of the chemical reaction C(s) + 2H 2 (g) → CH 4 (g) was lower than when hydrogen was used, the concentration of carbon on the film surface increased, resulting in enlargement of the ␣-SiC formation region. 16 Below 1000°C, the SiC films were composed mainly of the amorphous phase, whether the diluent gas was hydrogen or argon. Up to 1100°C, the as-deposited films exhibited similar XRD patterns, irrespective of the diluent gas used.…”
Section: Resultsmentioning
confidence: 99%
“…15,[22][23][24][25][26] An improvement of this situation can be achieved by a hydrogen etching procedure similar to a typical preparation step used before epitaxial SiC growth experiments. 27,28 When the sample is annealed in a quartz tube (e.g. in a CVD reactor) to 1500 • C under continuous H 2 gas flow at atmospheric pressure, a ( √ 3 × √ 3)R30 • LEED pattern with bright and sharp spots and practically no background is observed immediately after transfer of the sample into the UHV chamber without any further treatment (no HF dip, no outgassing).…”
Section: Silicate Monolayers Onmentioning
confidence: 99%
“…3 SiC coating etching can produce uncontrolled amounts of both Si and C in the gas phase, since Si may also etch preferentially from the coating. 4 SiC coating etching in the H 2 ambient was cited as the cause of Si island formation on SiC films grown on Si, 5 and the quality of the SiC coating on the graphite susceptor influenced the crystallinity and growth rate of SiC epilayers on Si. 6 Intentional and unintentional impurity incorporation in SiC epilayers can also be affected by the susceptor, since the C/Si ratio controls the impurity incorporation via site competition.…”
Section: Introductionmentioning
confidence: 99%