2007
DOI: 10.1016/j.tsf.2007.04.037
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Study of electrodeposition of bismuth telluride by voltammetric methods and in-situ electrochemical quartz crystal microbalance method

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Cited by 11 publications
(6 citation statements)
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“…Electrodeposition is therefore an appealing technique for the formation of complex compound semiconductor structures, as it can be performed at or near room temperature, minimizing interdiffusion. The most notable electrodeposition techniques include precipitation [28], codeposition [29,30], two stage [31] and atomic layer deposition (ALD) [32][33][34], also known as electrochemical atomic layer epitaxy (EC-ALE).…”
Section: Introductionmentioning
confidence: 99%
“…Electrodeposition is therefore an appealing technique for the formation of complex compound semiconductor structures, as it can be performed at or near room temperature, minimizing interdiffusion. The most notable electrodeposition techniques include precipitation [28], codeposition [29,30], two stage [31] and atomic layer deposition (ALD) [32][33][34], also known as electrochemical atomic layer epitaxy (EC-ALE).…”
Section: Introductionmentioning
confidence: 99%
“…23,24 It has been well established that the general process of Bi 2 Te 3 deposition on a noble metal electrode takes place by the reduction of HTeO 2 + followed by a subsequent reaction between Te 0 and Bi 3+ . 25,26 HTeO 2 3Te + 2Bi 3+ + 6e − → Bi 2 Te 3 [2] The results shown in Figure 2 indicate that the two-step formation of Bi 2 Te 3 occurred in the peak I region because almost the same peak height was observed in the three different electrolytes, as shown in Figures 2B-2D, which contain Bi 2 Te 3 oxidation peaks in their anodic waves. The peak current, i.e., number of electrons involved in the reduction at peak I, is almost independent of the ion concentration ratio.…”
Section: Resultsmentioning
confidence: 77%
“…Moreover, an ideal morphological property forms an indispensable prerequisite for practical thermoelectric application. Pulsed electro deposition [20][21] has already been studied to improve the film morphology, as to reduce surface roughness and eliminate porous structure. ECD in basic electrolyte is another option, though rarely reported [22][23].…”
Section: Introductionmentioning
confidence: 99%