Studies on thermally strain relieving behavior of ring configurations for a packaged SAW device chip

Yan, Deyang; Xu, Wei; Chen, Lei; Zhao, Chunming; Liang, Yao; Jiang, Luxia

doi:10.1109/icept.2014.6922726

2014 15th International Conference on Electronic Packaging Technology 2014

DOI: 10.1109/icept.2014.6922726

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Studies on thermally strain relieving behavior of ring configurations for a packaged SAW device chip

Deyang Yan

Wei Xu

Lei Chen

et al.

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Studies on thermally strain relieving behavior of ring configurations for a packaged SAW device chip

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References 8 publications

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