Abstract:With the growing of the applications of surface acoustic wave (SAW) devices, the requirement for the accuracy of the operating frequency of the SAW devices is constantly strengthened. The impact of thermal strain on the characteristics of SAW devices cannot be ignored, which induced in their packaging process. In this paper, by using the finite element method (FEM) software, the thermal strain induced in the F-11 package structure of a SAW device is analyzed. An approach to reduce the thermal strain induced in… Show more
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