Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin

Goh, Yingxin; Haseeb, A.S.M.A.

doi:10.1007/s10853-016-9883-x

Cited by 8 publications

(2 citation statements)

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“…Such effect has been described previously for co-plating of Sn-Bi. 21,22 The microstructure in Fig. 3e, however, showed a large numbers of pinholes, and the edges of the films showed non-uniform plating, although the number of dendrites observed was minimal.…”

Section: Resultsmentioning

confidence: 95%

“…20 Gelatin, a widely used leveler and grain refiner in metal electroplating processes, has been in use in the industry for several decades. 11 Although there have been studies on the individual effects on these two additives on Sn-Bi alloys, 21,22 very few efforts have been made to identify their combined effects on the electroplating of tin. Furthermore, the dominant mechanisms controlling the nucleation and growth processes during tin electrodeposition in the presence of these two additives are yet to be identified.…”

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confidence: 99%

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Effect of Additives on the Microstructure of Electroplated Tin Films

Arafat

Sultana

Dutta

et al. 2018

J. Electrochem. Soc.

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Electroplated tin films are important for several technologies such as microelectronics, Li-ion batteries, and corrosion-resistant coatings. In this paper, we demonstrate that the microstructure of tin films can be precisely controlled by addition of certain combinations of organic additives to a methanesulfonic acid based electroplating bath. Tin films are deposited on a copper substrate by varying the concentrations of two such additives, namely, hydroquinone and gelatin. The plating process is characterized by linear sweep voltammetry and insights into the resulting microstructure are obtained using imaging by scanning electron microscopy. It is found that the addition of hydroquinone alone results in non-uniform tin films having significant dendrites and does not affect the hydrogen gas evolution during electroplating. The addition of gelatin alone is found to suppress the evolution of hydrogen gas and affects the film nucleation process that controls its grain morphology, but also creates pinholes in the film and sludge in the bath. A combination of the two additives, however, yields a highly uniform grain structure with little to no dendrite formation and a delayed onset of hydrogen gas evolution, which is highly desirable during the electroplating process. Experiments are carried out that show that the mechanism of tin film nucleation and growth during electroplating is altered in the presence of the additives, where gelatin suppresses the tin nucleation rate (thereby controlling the grain size) as well as the formation of large dendrites; while hydroquinone, acting as an antioxidant, prevents pinholes, creates a uniform film, and avoids sludge formation in the presence of gelatin. This work demonstrates a path to control electroplated tin microstructures by varying bath chemistries and process parameters which will prove highly useful to industry.) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.237.114.176 Downloaded on 2018-12-20 to IP Journal of The Electrochemical Society, 165 (16) D816-D824 (2018) D817 ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.237.114.176 Downloaded on 2018-12-20 to IP ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.237.114.176 Downloaded on 2018-12-20 to IP

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Section: Resultsmentioning

confidence: 95%

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confidence: 99%