Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method

Suga, Tadatomo; Takahashi, Yoshihiro; Takagi, Hideki; Gibbesch, B.; Elssner, G.

doi:10.1016/0956-7151(92)90272-g

Cited by 208 publications

(78 citation statements)

References 2 publications

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“…Al foils and Si wafaers. 4,5) The other technique is smoothing the faying surface. Low surface roughness increases the bonded area and improves the strength of the bond accordingly.…”

Section: Introductionmentioning

confidence: 99%

Effect of Surface Asperity on Diffusion Bonding

2006

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The effect of surface asperity (mainly ridge height H, ridge wavelength W and aspect ratio H=W) on the diffusion bonding process was investigated. Ridge wavelength W as well as ridge height H have a significant effect on the properties of the diffusion bonded joint. The percent of bonded area increased with decreases in W and H. When the ridge height H was constant, an increase in aspect ratio H=W accelerated atomic diffusion at void surfaces and bonding interfaces, facilitated void shrinking and increased the bonded area. This can improve the strength of diffusion bonded joints. The percent of bonded area can be predicted by numerical analysis for surfaces prepared by lathe machining.

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“…Al foils and Si wafaers. 4,5) The other technique is smoothing the faying surface. Low surface roughness increases the bonded area and improves the strength of the bond accordingly.…”

Section: Introductionmentioning

confidence: 99%

Effect of Surface Asperity on Diffusion Bonding

2006

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“…Ion bombardment as a surface treatment of the bonding surface is considered to be an effective method. It has been reported that it is possible to make micro-bonding of similar and dissimilar materials, such as Si/Si, 8) Al/Al, 13,14) and Al/Si 3 N 4 , 14) at a room temperature after the argon ion bombardment treatment. However, it is not clear about the effect of ion bombardment treatment for the diffusion bonding of various metals yet.…”

Section: Introductionmentioning

confidence: 99%

Effect of Argon Ion Bombardment on Diffusion Bonding of SUS304L Stainless Steel and Pure Iron.

et al. 2002

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The surfaces of SUS304L stainless steel and pure iron specimens prepared by a lapping method were treated with argon ion bombardment, and then diffusion bonding was carried out. The effect of argon ion bombardment treatment on the properties of diffusion bonding joint was investigated by the tensile tests of joints and microstructure analyses of the fractured surfaces. The results showed that the argon ion bombardment treatment before bonding was effective to clean the bonding surface and reduce the inclusions at the bonded interface, so that the tensile strength of the bonded joints was improved and bonding temperature was lowered. The joint properties of pure iron were more excellent than those of SUS304L stainless steel. The amount of the inclusions at the joints with argon ion bombardment treatment depended on affinity of oxygen to metal.KEY WORDS: argon ion bombardment; diffusion bonding; SUS304L stainless steel; pure iron; microstructure; inclusion; oxide film.

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“…In the previous investigations, various metals and their alloys as well as the combinations to some ceramics and semiconductors have been bonded at room temperature in high vacuum. [8][9][10][11] The bonding of SnAg-Cu bumps has also achieved in ambient air and be found critical to air exposure time.…”

Section: Introductionmentioning

confidence: 99%

“…7) SAB method is based on the very strong metal or covalent bonding energy between two atomic clean surfaces. 8) The clean surfaces can be obtained by performing dry process such as argon fast atom beam or ion beam in high vacuum. In the previous investigations, various metals and their alloys as well as the combinations to some ceramics and semiconductors have been bonded at room temperature in high vacuum.…”

Section: Introductionmentioning

confidence: 99%

Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air

Wang

Suga

2008

Mater. Trans.

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Two solid-state bonding methods, thermocompression bonding (TCB) and surface activated bonding (SAB), were used for studying the effect of surface contamination on the bonding of Sn-Ag-Cu bumps in ambient air. The surface contamination was analyzed by X-ray photoelectron spectroscopy. Correlated to the surface contamination, the influence of Ar-plasma pretreatment time as well as the air exposure time on the shear strength was investigated in SAB process. The bonding of Sn-Ag-Cu bumps was achieved at C benefiting from dispersing the surface contamination. With an Ar-plasma activation process prior to the assembly under a low-vacuum background, the carbon contaminants on the bump surfaces in SAB process was removed, and the required bonding pressure or temperature to achieve a high shear strength and bond yield is lower than that in TCB process.

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Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method

Cited by 208 publications

References 2 publications

Effect of Surface Asperity on Diffusion Bonding

Effect of Surface Asperity on Diffusion Bonding

Effect of Argon Ion Bombardment on Diffusion Bonding of SUS304L Stainless Steel and Pure Iron.

Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air

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