Structure and properties of reactivity sputtered γ-Mo2N hard coatings

Anitha, V. P.; Vitta, Satish; Major, S.S.

doi:10.1016/0040-6090(94)90867-2

Cited by 23 publications

(12 citation statements)

References 7 publications

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“…It is observed that at large compressive stress the values of H and E are higher than the values at lower stress state, whereas the penetration of the indenter decreases. These values are smaller than those reported for γ-Mo 2 N coatings deposited on stainless steel substrates (23 GPa and 290 GPa for H and E respectively) [43] or a hardness of 33 GPa reported for sputtered cubic MoN 0.53 [42,53]. We can explain this by the changes in the bonding energy in the films when the nitrogen concentration increases.…”

Section: Hardness and Elastic Moduluscontrasting

confidence: 52%

“…In recent studies of Mo-N films [42], γ-MoN x phase was prepared with nitrogen partial pressure to total pressure ratios, P N2 /P T between 0.2 and 0.32 with the content of nitrogen in γ-MoN x phases in the range of x = 0.30-0.53 and crystallized in single-phase cubic-structure. The critical nitrogen concentrations for the Mo to γ-Mo 2 N phase transition varied from author to author [38,43]. Ozsdolay et al [31] have deposited MoN x /MgO(001) at different temperatures in the range 600°C to 1000°C, and the N/Mo ratio decreased when the temperature increased from 1.25 to 0.69 and reported a cubic rock-salt type structure.…”

Section: Films Compositionmentioning

confidence: 99%

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Correlation between mechanical and microstructural properties of molybdenum nitride thin films deposited on silicon by reactive R.F. magnetron discharge

Bouaouina

Besnard

Abaidia

et al. 2018

Surface and Coatings Technology

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. A B S T R A C TMolybdenum nitride thin films were deposited on (100) silicon substrates by R.F. magnetron sputtering of a Mo target in a (Ar-N 2 ) gas mixtures. The films were studied by Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and X-ray diffraction. The nanomechanical properties have been determined by nanoindentation and Peak-Force Quantitative Nanomechanical Mapping (PF-QNM). The total internal stresses were determined by curvature measurements and the Stoney formula. As thin film composition influences the morphology, the stress state and the mechanical properties, modifications are expected in this study where the nitrogen content is tuned. The film exhibits a polycrystalline structure with preferred orientation along (111) plane. The increase of the nitrogen content in the coating (N/ Mo = 1.1) induces a broadening of the full width at half maximum (FWHM) of the (111) diffraction peak, which is attributed to the presence of smaller crystallites. The residual stress and mechanical properties variation were correlated to the structural transition from γ-Mo 2 N to hexagonal and cubic MoN. The results show a good agreement between the nanomechanical properties obtained by nanoindentation and PF-QNM.

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Section: Hardness and Elastic Moduluscontrasting

confidence: 52%

Section: Films Compositionmentioning

confidence: 99%

Correlation between mechanical and microstructural properties of molybdenum nitride thin films deposited on silicon by reactive R.F. magnetron discharge

Bouaouina

Besnard

Abaidia

et al. 2018

Surface and Coatings Technology

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“…Based on the preceding results molybdenum is selected as the dilute insoluble element in this work. [11][12][13] Furthermore, our prior study on the Cu-Mo system shows that low film resistivity could be obtained by adding a small amount of Mo (ϳ2 at.%) and the fine-grained film structure is maintained after annealing. 16 In the present work, the differential scanning calorimetry (DSC) technique 17,18 was used to analyze the thermal stability behavior of Cu-Mo films.…”

Section: Introductionmentioning

confidence: 98%

“…[7][8][9][10] Molybdenum was considered to be a suitable material for gate and interconnection application because of its ability to defy change during high-temperature processing. [11][12][13] In our previous work, the properties of sputtered Cu films with various insoluble elements, such as C 14 and W, 15 have been studied. Based on the preceding results molybdenum is selected as the dilute insoluble element in this work.…”

Section: Introductionmentioning

confidence: 99%

Sputtered copper films with insoluble Mo for Cu metallization: A thermal annealing study

Lin

Chu

Mahalingam

et al. 2003

Journal of Elec Materi

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The thermal annealing behavior of Cu films containing insoluble 2.0 at.% Mo magnetron co-sputtered on Si substrates is discussed in the present study. The Cu-Mo films were vacuum annealed at temperatures ranging from 200°C to 800°C. X-ray diffraction (XRD) and scanning electron microscopy (SEM) observations have shown that Cu 4 Si was formed at 530°C, whereas pure Cu film exhibited Cu 4 Si growth at 400°C. Twins are observed in focused ion beam (FIB) images of as-deposited and 400°C annealed, pure Cu film, and these twins result from the intrinsically low stacking-fault energy. Twins appearing in pure Cu film may offer an extra diffusion channel during annealing for copper silicide formation. In Cu-Mo films, the shallow diffusion profiles for Cu into Si were observed through secondary ion mass spectroscopy (SIMS) analysis. Higher activation energy obtained through differential scanning calorimetry (DSC) analysis for the formation of copper silicide further confirms the beneficial effect of Mo on the thermal stability of Cu film.

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“…Anitha et al discussed the possible use of c-Mo 2 N thin film as a diffusion barrier layer in Si-based microelectronic devices to prevent the interdiffusion or reaction of the contact metal with the substrate silicon, and as a hard coating material (on machining tools and turbine blades) [7,8,22].…”

Section: Introductionmentioning

confidence: 99%

The wet corrosion of Mo and Mo-Ti alloy thin film - Part IV: The effect of nitriding

Tomachuk

Mitton

Špringer

et al. 2006

Materials and Corrosion

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A considerable number of detailed investigations have been carried out on the deposition and characterisation of molybdenum and molybdenum-titanium-nitride films by employing a variety of techniques. However, very little is currently known about the effect of composition (N 2 /Ar flow rate) on the corrosion properties of MoN and MoTiN thin films for aggressive ambient conditions. In this work, the electrochemical and corrosion behaviour of MoN and MoTiN thin films, produced by Physical Vapour Deposition (PVD) with different N 2 /Ar flow rates, has been investigated by Electrochemical Impedance Spectroscopy (EIS) in aerated alkaline chloride solution and compared with the behaviour of pure molybdenum in the same environment. Results obtained indicate that increasing nitrogen content in the film leads to a beneficial effect on the corrosion resistance, but results in decreased electrical conductivity of the film that may limit their application as back contact in photovoltaic modules.

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Structure and properties of reactivity sputtered γ-Mo2N hard coatings

Cited by 23 publications

References 7 publications

Correlation between mechanical and microstructural properties of molybdenum nitride thin films deposited on silicon by reactive R.F. magnetron discharge

Correlation between mechanical and microstructural properties of molybdenum nitride thin films deposited on silicon by reactive R.F. magnetron discharge

Sputtered copper films with insoluble Mo for Cu metallization: A thermal annealing study

The wet corrosion of Mo and Mo-Ti alloy thin film - Part IV: The effect of nitriding

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