Structure and electrocompression of chloride adlayers on Cu(111)

Gründer, Yvonne; Drünkler, A.; Golks, Frederik; Wijts, G.; Stettner, J.; Zegenhagen, J.; Magnussen, Olaf M.

doi:10.1016/j.susc.2011.06.009

Cited by 22 publications

(16 citation statements)

References 31 publications

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“…This value corresponds well to the distance of 0.42 nm between two neighboring Cl atoms of the Cl adlayer on the Cu(111) surface. [12] Additionally we find that the propagation speed of the steps is higher by at least a factor of 3 in Figure 3 d as compared to Figure 3 a.…”

Section: Methodsmentioning

confidence: 62%

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Yanson

Rost

2013

Angew Chem Int Ed

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Under the microscope: In situ, video-rate scanning-tunneling-microscopy imaging during Cu electrodeposition reveals a profound structural accelerating effect of Cl(-) on the deposition process. This effect could be present in systems with different metals and different additives. The structural accelerating effect is important for the fundamental understanding of electrodeposition phenomena and for applications in industry.

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Section: Methodsmentioning

confidence: 62%

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Yanson

Rost

2013

Angew Chem Int Ed

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“…With respect to the electrochemical interface between a metal electrode and an aqueous electrolyte it is also important to note that in an acid environment usually specific adsorption of anions occurs [1,2,45,46]. As far as the adsorption of halides is concerned, typical coverages are in the range of 0.33 − 0.45 [45][46][47][48][49][50]. The presence of such a relatively high coverage of anions of course also has a significant impact on the water structure on metal electrodes.…”

Section: Resultsmentioning

confidence: 99%

Water Structures at Metal Electrodes Studied by Ab Initio Molecular Dynamics Simulations

Groß

Gossenberger

Lin

et al. 2014

J. Electrochem. Soc.

102

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The structure of water on metal electrodes is addressed based on first-principles calculations. Special emphasis is paid on the competition between water-metal and water-water interaction as the structure determining factors. Thus the question will be discussed whether water at metal surfaces is ice-or rather liquid-like. The proper description of liquid phases requires to perform thermal averages. This has been done by combining first-principles electronic structure calculations with molecular dynamics simulations. After reviewing recent studies about water on flat, stepped and pre-covered metal electrodes, some new results will be presented.

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“…However, a change as distinct as the transition of the Cu layer from an incommensurate to a commensurate structure just by a change of environment seems unlikely, given the fact that Cl forms an incommensurate layer on Cu(111). 76 Furthermore, there is no indication from Cu-UPD from sulfuric acid that changing the environment alters the adsorbate structure. 19,49,77 Another point is the chloride concentration.…”

Section: Stmmentioning

confidence: 99%