Structure and Composition of Chemically Deposited Thin Films of Bismuth Sulfide and Copper Sulfide: Effect on Optical and Electrical Properties

Abstract

Chemically deposited thin films of bismuth sulfide (0.13 ~m) and copper sulfide (0.3 p~m) and copper sulfide films deposited on bismuth sulfide have been studied so as to obtain information about their structure, composition, thermal stability, and their effect on the optical and electrical properties. The studies establish that bismuth sulfide thin films

Maximizing Energy Storage of Flexible Aqueous Batteries through Decoupling Charge Carriers

“…954.3 eV matching with the satellite peak at 962.3 eV, suggesting that Cu (II) is dominant on the surface of the half‐discharged product. [ 20 ] Besides, the peaks at 162.9 and 161.8 eV correspond to S 2p 1/2 and S 2p 3/2 , respectively, which are consistent with previous reports for CuS (Figure S15, Supporting Information). [ 21 ] Meanwhile, two small peaks at 952.2 and 932.3 eV are also visible, which are attributed a small amount of Cu(I) species formed in Cu 2 S. After full discharge, the product only shows two strong peaks of Cu(I) 2p 3/2 at ca.…”

Interpreting Abnormal Charge–Discharge Plateau Migration in CuxS during Long-Term Cycling

“…Two peaks at 932.4 and 952.4 eV could be detected in the Cu 2p high-resolution XPS spectrum (Figure 1c), which could be deconvoluted into four subpeaks of Cu + (2p 3/2 : 932.4 eV, 2p 1/2 : 952.4 eV) 41,42 and Cu 2+ (2p 3/2 : 933.6 eV, 2p 1/2 : 953.7 eV). 43,44 With regards to the S 2p highresolution spectrum (Figure 2d), the binding energies centered at 161.5 and 162.6 eV are related to S 2p 3/2 and S 2p 1/2 . 45 And, another peak at 164.5 eV correspond to C−S bond.…”

Growth Kinetics of Copper Sulfide Thin Films by Chemical Bath Deposition

“…[3][4][5][6] Among various solution-based techniques, CBD is the most widely used technique for the deposition of Cu x S thin films. 4,[7][8][9][10][11][12][13][14][15][16] In a typical batch CBD process, Cu x S thin films are deposited by simply immersing the substrates in a dilute solution containing copper and sulfur reactive species. The reaction is thermally activated.…”