Structural optimization of a microjet based cooling system for high power LEDs

Liu, Sheng; Yang, Jyh‐Shinn; Gan, Zhiyin; Luo, Xiaobing

doi:10.1016/j.ijthermalsci.2007.09.005

Cited by 86 publications

(17 citation statements)

References 8 publications

(9 reference statements)

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“…The cooling system maintained the chip's surface temperature to just below 95 °C at the maximum heat load of 200 W. Assuming an ambient temperature of 20°C, the overall chip to air thermal resistance was in the range of 0.35 K/W. Liu et al [6] utilized a microjet array with mini fan cooled remote heat exchanger for cooling high power LEDs and achieved an overall thermal resistance of about 0.17 K/W. Chang et al [7] were able to achieve an overall thermal resistance of 0.23 K/W by implementing a microchannel heat sink in conjunction with a plate-fin type remote heat exchanger of which just under half (43%) was due to the microchannel heat sink.…”

Section: A C C E P T E D Accepted Manuscriptmentioning

confidence: 99%

A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger

Whelan

Kempers

Robinson

2012

Applied Thermal Engineering

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A liquid CPU cooler has been designed and tested with the aim to achieve a cooling capacity of 200 W for a surface area of 8.24 cm 2 , commensurate with the integrated heat spreader dimensions of an Intel® Pentium® 4 Processor. The primary aim of the design was to develop thermal hardware components that can be manufactured simply and cost effectively. To this end, a miniature jet array waterblock and a tube bundle remote heat exchanger were employed since the bulk of their housings could be manufactured using low cost injection molding techniques which could significantly reduce the total system cost compared with conventional units. The system was capable of dissipating the required heat load and exhibited an overall thermal resistance of 0.18 K/W requiring approximately 1.5 W of hydraulic power. At maximum power the chip-to-air temperature difference was 45°C which is adequately close to typical design thresholds. The influences of power loading and liquid volumetric flow rate are also discussed.

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Section: A C C E P T E D Accepted Manuscriptmentioning

confidence: 99%

A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger

Whelan

Kempers

Robinson

2012

Applied Thermal Engineering

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“…This demands a semi-active cooling or active cooling system integrated to the package [89]. It has been found that micro-jet cooling method can dissipate heat effectively [90][91][92][93]. Based on this technology, we designed the 220 W and 1.5 kW integrated LED light source with CoB package.…”

Section: Thermal Managementmentioning

confidence: 99%

Status and prospects for phosphor-based white LED packaging

Liu

Wang

et al. 2009

Front. Optoelectron. China

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The status and prospects for high-power, phosphor-based white light-emitting diode (LED) packaging have been presented. A system view for packaging design is proposed to address packaging issues. Four aspects of packaging are reviewed: optical control, thermal management, reliability and cost. Phosphor materials play the most important role in light extraction and color control. The conformal coating method improves the spatial color distribution (SCD) of LEDs. High refractive index (RI) encapsulants with high transmittance and modified surface morphology can enhance light extraction. Multi-phosphor-based packaging can realize the control of correlated color temperature (CCT) with high color rendering index (CRI). Effective thermal management can dissipate heat rapidly and reduce thermal stress caused by the mismatch of the coefficient of thermal expansion (CTE). Chip-on-board (CoB) technology with a multilayer ceramic substrate is the most promising method for high-power LED packaging. Low junction temperature will improve the reliability and provide longer life. Advanced processes, precise fabrication and careful operation are essential for high reliability LEDs. Cost is one of the biggest obstacles for the penetration of white LEDs into the market for general illumination products. Mass production in terms of CoB, system in packaging (SiP), 3D packaging and wafer level packaging (WLP) can reduce the cost significantly, especially when chip cost is lowered by using a large wafer size.

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“…There are several aspects having been studied in heat dissipation, such as package design [1][2][3][4], thermal interface material [5], low thermal resistance heat sink material [6][7][8][9], and cooling systems [10][11][12][13][14]. The best-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes with vapor chambers which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics [15,16].…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation of copper-grooved micro heat pipes (MHPs)

et al. 2014

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With the excellent thermal conductivity and the compatibility to micro electromechanical systems technology, silicon is widely used in micro heat pipes (MHPs). Copper shows higher heat transfer capability and capillary traction than silicon. Copper microgrooves were fabricated on the silicon wafer using electroforming technique in this paper. Water contact angle measurements and thermal behavior tests demonstrated that copper-grooved MHPs showed better performance than silicon ones. Under the input power of 5.99 W, the equivalent thermal conductivities of copper-grooved and silicon-grooved MHPs were 228.98 W/K · m and 196.26 W/K · m. This work showed the feasibility of copper grooved silicon based MHPs in heat transfer for high-power light emitting diode (HP LED).

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Structural optimization of a microjet based cooling system for high power LEDs

Cited by 86 publications

References 8 publications

A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger

A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger

Status and prospects for phosphor-based white LED packaging

Experimental investigation of copper-grooved micro heat pipes (MHPs)

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