“…Both structures have been investigated using various deposition techniques such as atomic layer deposition (ALD), − sputtering, chemical vapor deposition, laser ablation synthesis, and the sol–gel method . These previous studies reported that InO x generally formed a clear polycrystalline cubic structure with a preferred orientation of (211), (222), or (400), depending on the deposition method and process conditions. − Among them, ALD has emerged as a promising deposition technique due to its low-temperature process, good uniformity, excellent step coverage, and controllability of material properties, such as the binding state and crystallinity . In addition, some previous studies have reported that the preferable electrical performance of ALD-processed InO x devices is comparable with those synthesized by a solution and sputtering because of the higher film density induced by a self-limited reaction on the growth surface. ,, For these reasons, the ALD-processed InO x film may be a promising active channel layer for the backplane of next-generation displays. ,, Yeom et al demonstrate the device with the high mobility of 39 cm 2 /V s using the Et 2 InN(SiMe 3 ) 2 precursor, and Lee et al also present the InO x TFT device using the ([3-(dimethylamino)propyl]dimethyl indium) (DADI) precursor.…”