2008
DOI: 10.1016/j.tsf.2007.06.060
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Structural changes of hot-wire CVD silicon carbide thin films induced by gas flow rates

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Cited by 4 publications
(1 citation statement)
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“…12 However, from the viewpoint of cost reduction and practical application, employing SiH 4 /CH 4 gas mixture without H 2 could be advantageous because hydrogen dilution tends to reduce the deposition rate of the films. [22][23][24] To date, there are no reported works on the deposition of nanocrystalline-3C-SiC (nc-3C-SiC) film by the HWCVD technique using only SiH 4 and CH 4 . This motivates us to investigate the growth of nanocrystalline SiC at low temperature by HWCVD technique from SiH 4 /CH 4 gas mixture without hydrogen dilution.…”
Section: Introductionmentioning
confidence: 99%
“…12 However, from the viewpoint of cost reduction and practical application, employing SiH 4 /CH 4 gas mixture without H 2 could be advantageous because hydrogen dilution tends to reduce the deposition rate of the films. [22][23][24] To date, there are no reported works on the deposition of nanocrystalline-3C-SiC (nc-3C-SiC) film by the HWCVD technique using only SiH 4 and CH 4 . This motivates us to investigate the growth of nanocrystalline SiC at low temperature by HWCVD technique from SiH 4 /CH 4 gas mixture without hydrogen dilution.…”
Section: Introductionmentioning
confidence: 99%