“…Greek: α, Seebeck coefficient (V K −1 ); γ, electrical conductivity (S m −1 ); τ, Thomson coefficient (V K −1 ); θ, relaxation coefficient; λ, thermal diffusivity (m 2 s −1 ); ρ, density (kg m −3 ); η, efficiency (%) Subscripts: e, w, n, s, control interfaces; P, E, W, N, S, control volumes; cold, cold side of the TEM; hot, hot side of the TEM; OC, open circuit used as the encapsulation material to provide a flexible support for the thermoelectric legs when TEG was subjected to external stress and/or vibration. 4,5 Further, due to low thermal conductivity (0.23 Wm −1 K −1 ) of PDMS, 4 the thermal resistance introduced by PDMS encapsulation will block the heat transfer through the encapsulation components. Then, the heat harvesting could be concentrated in the region of thermoelectric legs, which is beneficial for the voltage generation.…”