“…[4][5][6][7][8][9] Various deposition techniques, such as electroless deposition, [10,11] electrochemical deposition, [12,13] and physical/chemical vapor deposition, [14,15] are potentially useful for the fabrication of required surface structures and modification layers for the special and switchable wettability. However, these deposition techniques often induce residual stress including tensile and compressive stresses in the deposited films, [16][17][18][19][20][21][22] which can affect not only their mechanical properties (e.g., hardness and strength), but also some physical properties (e.g., photoluminescence and photocatalysis) due to the distortion of the crystalline structure. [23][24][25][26][27][28] Furthermore, the presence of residual stress can lead to structural change of deposited films (e.g., stress corrosion or film cracking).…”