2010
DOI: 10.1016/j.jcrysgro.2009.11.061
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Stress in electrodeposited CoFe alloy films

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Cited by 23 publications
(12 citation statements)
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“…The cracks can also be formed by interfacial mechanical coupling between the film and substrate, which is increased by the film thickness or decreasing the grain size [8,14]. According to the present results, by increasing current density tungsten content of the deposits decreased.…”
Section: Morphology and Composition Of The Coatingssupporting
confidence: 56%
See 1 more Smart Citation
“…The cracks can also be formed by interfacial mechanical coupling between the film and substrate, which is increased by the film thickness or decreasing the grain size [8,14]. According to the present results, by increasing current density tungsten content of the deposits decreased.…”
Section: Morphology and Composition Of The Coatingssupporting
confidence: 56%
“…This leads to hydroxide incorporation in the deposited films and causes film embrittlement and magnetic moment reduction. To make high quality Fe containing alloy coatings; addition of a reducing agent and use of inert atmosphere are suitable [8]. Many investigations have been focoused to study magnetic properties of these alloys.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, the fine grains of the Cu film generate a large volume of grain boundaries, which can enhance further the tensile stress due to the relatively random arrangement of Cu atoms. [22] After the Cu film grows to the required thickness, the generated tensile stress will remain in the as-prepared Cu film in the form of residual stress.…”
Section: Resultsmentioning
confidence: 99%
“…[4][5][6][7][8][9] Various deposition techniques, such as electroless deposition, [10,11] electrochemical deposition, [12,13] and physical/chemical vapor deposition, [14,15] are potentially useful for the fabrication of required surface structures and modification layers for the special and switchable wettability. However, these deposition techniques often induce residual stress including tensile and compressive stresses in the deposited films, [16][17][18][19][20][21][22] which can affect not only their mechanical properties (e.g., hardness and strength), but also some physical properties (e.g., photoluminescence and photocatalysis) due to the distortion of the crystalline structure. [23][24][25][26][27][28] Furthermore, the presence of residual stress can lead to structural change of deposited films (e.g., stress corrosion or film cracking).…”
Section: Introductionmentioning
confidence: 99%
“…in read-write heads of magnetic storage devices, electronic bearings, high-temperature space powder system, and microactuators [8][9][10][11]. Therefore much efforts such as radio frequency plasma torch [12][13][14][15], mechanical alloying [16][17][18][19][20][21], electrodeposition [22][23][24][25][26][27][28][29][30][31], co-sputtering deposition [32][33][34], solvothermal treatment [35], thermal decomposition [36][37][38][39][40], solution phase synthesis [41][42][43][44][45][46][47][48][49][50][51], chemical vapor condensation [52], and sonolysis in organic solvent [53,54] had been devoted to produce FeCo alloys nanostructures. Solution phase synthesis strategies for FeCo nanoparticles have adva...…”
Section: Introductionmentioning
confidence: 99%