Stress development and relaxation during reactive film formation of Ni2Si

Exploring Ni–Si thin-film reactions by means of simultaneous synchrotron X-Ray diffraction and substrate curvature measurements

“…This behavior has been also confirmed by isothermal experiments which are not shown here [23]. It is important to remark that this strain or stress behavior results also in a bell shape evolution of the force and thus can be described quantitatively by the Zhang-d'Heurle model as shown by Liew et al [13] for Ni 2 Si. One should, however, note that a bell shape behavior may be obtained from a change in the sign of the growth stress.…”

“…1 shows the changes in F/W in nickel film on Si as a function of temperature during the heating cycle. This curve is very similar to those obtained by Tsai [11], Liew [13] or Steegen [18]. The force evolution has been already described in five main stages [19,20] In this experiment, X-ray diffraction spectra are recorded at the same time.…”

“…A model [10] developed by Zhang and d'Heurle rationalizes stress evolution in terms of competing growth and stress relaxation rates. It has been successfully used previously for the Pd/Si system [3][4][5][6][7] and more recently by Liew [13] for the Ni 2 Si phase growth from Ni-Si reaction.…”

“…Two recent in-situ curvature experiments have been performed on the Ni-Si system by Tsai [11] and by Liew [13]. They both observed a complex force evolution with a number of genuine features.…”

Comparison of microstructure and oxidation behavior between Pt-free and Pt-modified δ-Ni 2 Si coatings on Ni-based superalloys

“…As a result, there is a high tendency between Ni and Si to form ␦-Ni 2 Si during the pack cementation [38]. Previous study has shown that the ␦-Ni 2 Si is preferentially formed during the reaction between Ni and Si [39]. The formation mechanisms of Pt-modified and Pt-free ␦-Ni 2 Si coatings can be shown in Fig.…”