Stress analysis of the adhesive resin layer in a reinforced pin-loaded joint used in glass structures

To, Quy‐Dong; He, Qi‐Chang; Cossavella, M.; Morcant, K.; Panait, A.

doi:10.1016/j.ijadhadh.2008.01.008

Cited by 4 publications

(1 citation statement)

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“…The intermediate layer between the steel ring and the glass plate is made of a glue material which, compared with steel and glass, is so soft that the strain and stress fields in the glue layer are essentially due to the relative horizontal rigid displacement d of the ring and the plate. In other words, the infinitesimal deformations of the ring and the plate have negligible effects on the strain and the stress fields inside the intermediate zone (for more details, see To et al, 2007).…”

Section: Determination Of the Stress Field In The Intermediate Layermentioning

confidence: 99%

Closed-form solution for the contact problem of reinforced pin-loaded joints used in glass structures

He²,

Cossavella

et al. 2007

International Journal of Solids and Structures

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International audienceIn a typical pin-loaded joint used to assemble glass plates, the hole in a glass plate is reinforced by a steel ring glued to the glass plate via a soft resin layer. Thus, the ring is in direct contact with the steel bolt and prevents the glass plate from high stress concentration. This paper proposes an analytical approach to solving the resulting conforming contact problem. The strain and stress fields inside the resin layer are first determined by exploiting the fact that the stiffness of the material constituting it is much smaller than the stiffness of steel and glass. After finding the relevant Green functions for the ring and pin, the frictionless contact between them is then formulated in terms of an integral equation with a Fourier series as the kernel. This integral equation is solved by neglecting the terms of high orders and transforming it into the Cauchy singular integral equation. The derived analytical results for the contact pressure and angle are finally compared to and validated by those obtained by the finite element method. (C) 2006 Elsevier Ltd. All rights reserved

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Section: Determination Of the Stress Field In The Intermediate Layermentioning

confidence: 99%