Strength Evaluation of Specimens Mounted with Underfill Resins in Mobile Apparatus

Yaguchi, Akihiro; Nakamura, Masato; Ishikawa, Takashi; Kurosawa, Kazuhito; Kimoto, Ryosuke

doi:10.5104/jiep.7.613

Cited by 2 publications

(1 citation statement)

References 2 publications

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“…Thus, it was concluded that the underfill resin was effective in improving the connection reliability. In contrast, Yaguchi et al 6 conducted thermal cycle tests in BGA packages with underfill resin at −40°C/85°C and −55°C/125°C and found that the disconnection life of the solder joints was shorter than that without the underfill resin. They suggested that to improve fatigue life under thermal cycling, the underfill resin should have a similar coefficient of linear expansion to the solder material and a low elastic modulus.…”

Section: Introductionmentioning

confidence: 97%

Evaluation of thermal fatigue crack propagation in underfill resin materials for electronic packages

Watanabe

Yamaguchi²,

Enomoto³

et al. 2022

Fatigue Fract Eng Mat Struct

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To improve the fatigue life of electronic packages, it is necessary to clarify thermal fatigue characteristics of underfill resin materials. In this study, a new setup for measuring thermal fatigue crack growth was developed, and the effects of thermal cycle conditions and silica filler contents on fatigue crack propagation were investigated. The results show that the likelihood of crack initiation increased with the filler content and the temperature of the thermal cycles. Comparing the results with those from mechanical fatigue tests, crack initiation and propagation occurred at lower ΔK and the crack growth rates were higher for thermal fatigue. Observations of the fracture surface revealed that the cracks propagated inside the underfill resin, which resulted in smaller crack growth resistance than that in mechanical fatigue. The addition of fillers introduced a crack propagation path at the interface between fillers and resins and enhanced the crack propagation resistance in thermal fatigue.

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Section: Introductionmentioning

confidence: 97%

Evaluation of thermal fatigue crack propagation in underfill resin materials for electronic packages

Watanabe

Yamaguchi²,

Enomoto³

et al. 2022

Fatigue Fract Eng Mat Struct

View full text Add to dashboard Cite

show abstract

Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Shohji

Yoshizawa

Nishimoto³

et al. 2007

KEM

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The effect of the mechanical and physical properties of an underfill material on thermal stress relief in a lead-free chip size package (CSP) solder joint has been investigated. Thin sheets of underfill materials for the CSP solder joint were prepared and the mechanical and physical properties of the sheets were investigated. Using these properties, thermal stress relief in an encapsulated CSP lead-free solder joint with the underfill material was examined by a finite element analysis method under thermal cycle conditions in the temperature range from 293K to 398K and 233K.

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Strength Evaluation of Specimens Mounted with Underfill Resins in Mobile Apparatus

Cited by 2 publications

References 2 publications

Evaluation of thermal fatigue crack propagation in underfill resin materials for electronic packages

Evaluation of thermal fatigue crack propagation in underfill resin materials for electronic packages

Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

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