Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Shohji, Ikuo; Yoshizawa, Keisuke; Nishimoto, Masaharu; Kawano, Takayuki

doi:10.4028/www.scientific.net/kem.353-358.2029

Cited by 4 publications

(4 citation statements)

References 6 publications

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“…1 shows a cross sectional view of a CSP solder joint. Detailed specifications of CSP, the substrate and reflow soldering have been described in the previous report [9]. The chemical composition of the solder in the CSP joint was approximately Sn-3.5mass%Ag-0.75mass%Cu [9].…”

Section: Methodsmentioning

confidence: 99%

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Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

Shohji

Tohei

Yoshizawa

et al. 2008

KEM

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Accelerated thermal cycling (ATC) tests were conducted to investigate an effect of thermal cycle conditions on thermal fatigue life of a chip size package (CSP) lead-free solder joint. A ternary Sn-Ag-Cu alloy was used as a lead-free solder material. For frequency of thermal cycle (1~3 cycles/h) and maximum (388~423 K) and minimum (223~273 K) temperatures investigated, the effects of them on thermal fatigue life of the solder joint were slight. On the contrary, correlation was recognized between temperature amplitude and thermal fatigue life of the solder joint. The thermal fatigue life increased with decreasing temperature amplitude. The relationship obeyed the Coffin-Manson’s type equation.

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Section: Methodsmentioning

confidence: 99%

“…Detailed specifications of CSP, the substrate and reflow soldering have been described in the previous report [9]. The chemical composition of the solder in the CSP joint was approximately Sn-3.5mass%Ag-0.75mass%Cu [9]. ATC tests were conducted under eight conditions as shown in Table 1.…”

Section: Methodsmentioning

confidence: 99%

Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

Shohji

Tohei

Yoshizawa

et al. 2008

KEM

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“…It was reported that the thermal fatigue life of solder joint degrades compared with that of the original solder joint unless suitable UF is applied. [4,5] Thus, investigation of material properties of UF is very important to design the solder joint reliability. [6] Current UF materials include many kinds of additives such as a curing agent, filler, a coupling agent, a coloring agent and so on.…”

Section: Introductionmentioning

confidence: 99%

Effect of Filler Content and Coupling Agent on Mechanical Properties of Underfill Material

Mitsugi

Kitagoh

Shohji

et al. 2014

Transactions of The Japan Institute of Electronics Packaging

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Effects of filler content and coupling agent on mechanical properties of underfill (UF) were investigated using standard UF materials which are composed bisphenol F-type epoxy resin and spheroidal SiO 2 filler. For the effect of filler content, elastic modulus of UF increased and fracture strain decreased with increasing the filler content. On the contrary, the effect on tensile strength was negligible. When the temperature was above Tg, elastic modulus decreased and fracture strain increased remarkably. Fracture mainly occurred in matrix resin below Tg and in the interface between matrix resin and filler above Tg. Moreover, it was confirmed that tensile strength and fracture strain were decreased by aging treatment. For the effect of coupling agent, elastic modulus and tensile strength of UF were increased by coupling treatment. Fracture strain was increased at R.T., but was decreased at 80°C and 120°C by coupling treatment. Tensile strength depends on the interfacial state of matrix resin and fillers. Peeling of fillers from matrix resin was suppressed by coupling treatment at the temperature under 80°C. Fracture mode of UF with coupling treatment changed from matrix fracture to interfacial fracture in the boundary of Tg.

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“…n value in the Coffin Manson's equation was estimated to be 1.8. Table 2 Mechanical and physical properties of underfill materials studied 5) . …”

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confidence: 99%

Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

Tohei¹,

Shohji²,

Yoshizawa³

et al. 2008

J. Japan Inst. Metals

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The effect of filler content in an underfill material on thermal fatigue life of a lead free solder joint of a chip size package (CSP) has been investigated. Three types of bisphenol F type epoxy based underfill material, which filler content was changed from 0 to 60 mass, were prepared. The thermal cycle test in a temperature range from -40 to 125°C was conducted to investigate thermal fatigue lives of solder joints encapsulated with underfill materials. Plastic strain range loaded in the solder joint under thermal cycle conditions was investigated by a finite element analysis method. From the thermal cycle test results, it was clarified that the thermal fatigue life of the solder joint increases with increasing filler content in the underfill material investigated. Moreover, a Coffin Manson type of relation was obtained between the plastic strain range and the thermal fatigue life. n value in the Coffin Manson's equation was estimated to be 1.8.

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Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Cited by 4 publications

References 6 publications

Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

Effect of Filler Content and Coupling Agent on Mechanical Properties of Underfill Material

Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

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