Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Zhang, Hanzhuo; Jiang, Zhonghao; Lian, Jianshe; Jiang, Qing

doi:10.1016/j.msea.2007.06.027

Cited by 29 publications

(14 citation statements)

References 24 publications

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“…9 (b) and its inset show the typical SEM images of the fracture surface in the nt-Cu stress-jump-crept from 100 MPa to 400 MPa at temperature 70°C, displaying that high density of fracture dimples spread uniformly and extend across most of the specimen cross-section. The dimple size is 2 μm in average, which is two orders of magnitude larger than the average twin thickness, thereby indicating that local plastic deformation is not confined by the size of nanotwins but develops to a greater scale (Zhang et al, 2008). In the nt specimens, partial and perfect dislocations can easily be emitted from the TB-GB intersections and other locations with high stress concentrations, which has been reported by the in-situ HRTEM observation on nt-Cu during mechanical tests (Lu et al, 2015).…”

Section: Resistance Of Nanotwins Against Creep Deformationmentioning

confidence: 99%

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Yang

Wang

et al. 2016

Acta Materialia

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a b s t r a c tIn the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22°C (RT), 40°C, 50°C, 60°C, and 70°C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinning could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper.

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Section: Resistance Of Nanotwins Against Creep Deformationmentioning

confidence: 99%

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Yang

Wang

et al. 2016

Acta Materialia

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“…The results of the comparison of experimental and simulated stress-strain response are plotted in Figure 2 while parameters identified are shown in Table 1 . Zhang et al [10] performed experimental studies to understand tensile behavior of ultrafine grain Copper (Cu). It was reported that as the strain rate is increased ductility is also increased.…”

Section: Resultsmentioning

confidence: 99%

“…Based on the experimental findings [6], [10], [27], it is assumed that plastic part of the deformation and the damage initiation at the onset of coalescence are strongly dependent upon the strain rates while damage evolution after the onset of void coalescence is rate independent. Rate-dependent plasticity is incorporated using a rate potential [23], [24], [26] while after the onset of the coalescence rate independent potentials have been used [1].…”

Section: Wherementioning

confidence: 99%

A multiscale phenomenological constitutive model for strain rate dependent tensile ductility in nanocrystalline metals

Siddiq

Sayed²

2015

Materials Letters

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A variational multiscale constitutive model that accounts for strain rate dependent ductility of nanocrystalline materials during intergranular failure has been presented. The presented model is an extension of the previous work [1], in which a nanocrystalline material is modelled as two-phase with grain interior being modelled using crystal plasticity theory while grain boundary affected zone using porous plasticity model which accounts for ductile damage due to void growth and coalescence. The model capability of capturing the strain rate dependent deformation and failure has been demonstrated through validations against uniaxial test data taken from literature. The validated results show a good agreement between experimental and simulated response.

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“…6,9,19 The density of the nc Ni was measured by Archimedes principle to be 8.876Ϯ 0.02 g / cm 3 , which is ϳ99.7% of the theoretical density of pure Ni ͑8.902 g / cm 3 ͒. 6,9,19 The density of the nc Ni was measured by Archimedes principle to be 8.876Ϯ 0.02 g / cm 3 , which is ϳ99.7% of the theoretical density of pure Ni ͑8.902 g / cm 3 ͒.…”

Section: Methodsmentioning

confidence: 99%

Tensile-relaxation behavior of electrodeposited nanocrystalline Ni

Shen

Lian

et al. 2010

Journal of Applied Physics

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The electrodeposited nanocrystalline ͑nc͒ Ni with an average grain size of 27 nm by the tensile-relaxation tests shows substantial increase in ductility up to 10.7%-11.8% at all tested strain rates ͑from 4.17ϫ 10 −5 to 4.17 s −1 ͒, which is evidently higher than those ͑6%-10%͒ attained in the routine continuous tensile tests; while the ductility of the compared coarse-grained ͑CG͒ Ni almost keep invariable under the same two kinds of tension mode. Additionally, the notable stress softening and the subsequently parabola of convergence increase in flow stress ͑i.e., new strain hardening behavior͒ upon reloading was only observed in nc Ni during the tensile-relaxation tests, which illuminates that nc Ni lacks a permanent dislocation network like that in CG Ni during deformation process.

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Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Cited by 29 publications

References 24 publications

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

A multiscale phenomenological constitutive model for strain rate dependent tensile ductility in nanocrystalline metals

Tensile-relaxation behavior of electrodeposited nanocrystalline Ni

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