2017
DOI: 10.1038/s41467-017-00516-5
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Strain-engineered growth of two-dimensional materials

Abstract: The application of strain to semiconductors allows for controlled modification of their band structure. This principle is employed for the manufacturing of devices ranging from high-performance transistors to solid-state lasers. Traditionally, strain is typically achieved via growth on lattice-mismatched substrates. For two-dimensional (2D) semiconductors, this is not feasible as they typically do not interact epitaxially with the substrate. Here, we demonstrate controlled strain engineering of 2D semiconducto… Show more

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Cited by 271 publications
(267 citation statements)
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“…4(c). The parameter ∆, describing the orbital gap at K and K' valley, decreases as we increase the lattice constant in agreement with literature [48,54,[75][76][77][78]. Keeping the orbital decomposed band structure ( Fig.…”
Section: Geometry Band Structure and Fitted Resultssupporting
confidence: 89%
“…4(c). The parameter ∆, describing the orbital gap at K and K' valley, decreases as we increase the lattice constant in agreement with literature [48,54,[75][76][77][78]. Keeping the orbital decomposed band structure ( Fig.…”
Section: Geometry Band Structure and Fitted Resultssupporting
confidence: 89%
“…The following are Raman and photoluminescence (PL) spectra characterization under 532nm excitation. The exfoliated WSe2 clearly presents two Raman peaks in the range of 250 and 260 cm -1 (Figure 3c), which correspond to the in-plane Raman and AFM data, this change can be caused by the interaction between the sample and different substrates [39].…”
Section: Characterization and Device Performancementioning
confidence: 59%
“…The heterostructures of 2D materials with graphene also induce the change of graphene's shape and the configuration of the heterostructures, giving rise to novel electronic and photoelectric properties 2,33,34. More importantly, the electronic and optical performances of 2D semiconductors can be further tuned by strain engineering for device applications 35,36…”
Section: Introductionmentioning
confidence: 99%