2011
DOI: 10.1063/1.3605255
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Stimulated emission of near-infrared radiation in silicon fin light-emitting diode

Abstract: We propose top-down processes to make silicon multiple quantum wells called fins for a lightemitting diode. The silicon fins are formed vertically to a substrate and embedded in a Si 3 N 4 waveguide. By current injections into silicon fins, we have observed stimulated emission spectra peaked at the wavelengths corresponding to the periodic structures of fins. The near-field mode profiles obtained at the edge of the waveguide qualitatively agreed with theoretical calculations. It has been turned out that both t… Show more

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Cited by 17 publications
(22 citation statements)
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“…4, we show the current-voltage characteristics of the Ge FinLED with a reference result of the Si FinLED. 7 We found excellent rectifying characteristics with the ideality factor of 1.27 in both Ge and Si FinLEDs, showing good interfacial qualities with low interface traps. The dark currents of the Ge FinLED are increased substantially compared with those of the Si FinLED, but the observed ultralow dark current density of 1.86 Â 10 À5 (3.41 Â 10 À3 ) A/cm 2 at the reverse bias of 1(5) V is comparable to those reported as the record low dark currents.…”
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confidence: 85%
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“…4, we show the current-voltage characteristics of the Ge FinLED with a reference result of the Si FinLED. 7 We found excellent rectifying characteristics with the ideality factor of 1.27 in both Ge and Si FinLEDs, showing good interfacial qualities with low interface traps. The dark currents of the Ge FinLED are increased substantially compared with those of the Si FinLED, but the observed ultralow dark current density of 1.86 Â 10 À5 (3.41 Â 10 À3 ) A/cm 2 at the reverse bias of 1(5) V is comparable to those reported as the record low dark currents.…”
mentioning
confidence: 85%
“…16) were also fabricated to enhance the hole mobility by the oxidation condensation techniques. 16,17 The present pure Ge fins can be made by the extensions of previous works, 7,15,16 and Ge FinLEDs will be integrated with Si or Ge FinFETs on the same chip by small modifications of the process steps.…”
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confidence: 99%
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“…Extensive research has been conducted on porous Si [15], Si nanocrystals [16], ultrathin Si quantum wells (QWs) [17], Si and SiGe nanostructures [18], GeSn [19], Si Raman lasers [20], and III-V lasers grown on [21] or bonded to Si [22]. While stimulated emission from ultrathin Si QWs has been observed, the gain is not enough to overcome losses and enable lasing [23]. Thus, the hybrid integration of Ge and III-V materials-based optoelectronic devices with traditional Si CMOS technology would revolutionize technology needs in the near future.…”
Section: Introductionmentioning
confidence: 99%