Steady-state temperature solution for early design of Annealed Pyrolytic Graphite heat spreader: Full results

Monier-Vinard, Eric; Nguyen, Minh-Nhat; Laraqi, Najib; Bissuel, Valentin; Daniel, Olivier

doi:10.1109/itherm.2016.7517647

Cited by 4 publications

(2 citation statements)

References 13 publications

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“…Indeed, the knowledge and control of the temperature of electronic chips is essential in order to control the life of the latter. Many studies address the thermal behaviour in the substrate whether in a variable or steady state by analytical approaches(Monier-Vinard, Laraqi, Dia, Nguyen, & Bissuel 2013;2016;Monier-Vinard, Nguyen, Laraqi, Bissuel, & Daniel 2016;. The numerical solutions require particularly high computation times due to the numerical mesh required for their implementation.…”

Section: Introductionmentioning

confidence: 99%

Transient thermal behaviour of a substrate subjected to the activation of an electronic chip and surface cooling

Bauzin,

Cherikh,

Hocine

et al. 2023

J. eng. process. manag.

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<p>Controlling the temperature of electronic components is a major interest for the electronics industry. Indeed, the lifetime of the components is directly dependent on the temperature levels reached in the electronic boards. Then, it is essential to predict the chip temperature evolution in order to maximize their lifespan. The electronic boards are more and more complex. They are multi-layers composed of different materials. The numerical resolution of the heat transfer equations in these systems requires very fine meshes and therefore very high computation times. It is possible to standardize the characteristics of these multilayer boards in order to treat them as a homogeneous material. The study presented in this work uses this approach and deals with the transient thermal behaviour of a substrate and its chip. The entire surface of the electronic board is cooled by convection. The developed model assumes that the surface convection coefficient is known, constant and uniform. The heat transfer by conduction in the substrate is based on an axisymmetric assumption on the longitudinal dimensions of the exchange surface (r, theta) and an assumption of semi-infinite medium in the transversal direction of the plate (thickness z). These assumptions are verified if, on the one hand, the activation times of the electronic chips are low enough and the dimensions of the chip is small compared to the electronic board. In these conditions, a fully analytical model is developed considering two successive integral transforms: a Laplace transform for the temporal variable, and a Hankel transform for the radial variable. An explicit expression of the temperature of the surface heated by the component is established, requiring very short computation times compared to numerical simulations. This model can be easily incorporated into a dimensioning code for electronic devices to predict their temperature.&nbsp; It can also be used as a direct model in an inverse procedure for identifying parameters on electronic boards.</p>

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Section: Introductionmentioning

confidence: 99%

Transient thermal behaviour of a substrate subjected to the activation of an electronic chip and surface cooling

Bauzin,

Cherikh,

Hocine

et al. 2023

J. eng. process. manag.

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“…Because the heat spreading and dissipation is the key technology for most systems of semiconductor lighting and mobile communication devices [1]. Reduction of heat generation and fast heat spreading control are getting important for the application to smaller and lighter devices.…”

Section: Introductionmentioning

confidence: 99%

Comparison Method to Estimate Surface Directional Thermal Conductivity of Ultrathin Graphite Thermal Sheets

Cho¹,

Jang²

2018

Asian J. Chem.

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The steady state comparison method providing a simple and fast estimation for the thermal conductivity of ultrathin thermal sheet is suggested. The surface directional thermal conductivity of ultrathin graphite sheet was estimated by the steady state comparison method. The estimation was performed as a function of temperature profile along the heat spreading surface direction. At steady state condition, the temperature difference ratio of copper and aluminum ultrathin thermal sheets at the same distance from heat source showed the same value of inverse ratio of thermal conductivities of those two materials. We could find the surface directional thermal conductivity of ultrathin graphite sheet by the comparison method at the steady state. The estimated value of the surface directional thermal conductivity of ultrathin graphite thermal sheet was very close to the pre-reported value of it.

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Reliability of Automotive Multidomain Controllers: Advancements in electronics cooling technologies

Korta¹,

Skruch

Holon³

2021

IEEE Veh. Technol. Mag.

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Steady-state temperature solution for early design of Annealed Pyrolytic Graphite heat spreader: Full results

Cited by 4 publications

References 13 publications

Transient thermal behaviour of a substrate subjected to the activation of an electronic chip and surface cooling

Transient thermal behaviour of a substrate subjected to the activation of an electronic chip and surface cooling

Comparison Method to Estimate Surface Directional Thermal Conductivity of Ultrathin Graphite Thermal Sheets

Reliability of Automotive Multidomain Controllers: Advancements in electronics cooling technologies

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