1996
DOI: 10.1109/81.502212
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Statistical techniques for the computer-aided optimization of analog integrated circuit

Abstract: A CAD tool capable of performing statistical circuit simulation, design, and optimization is described. The core of this tool is a general, CAD-compatible, statistical model which accounts for the effect of device area, transistor bias, and circuit layout on the variation of MOS integrated circuits. The statistical model has been incorporated into an object-oriented circuit simulator, APLAC, which has sufficient flexibility to allow optimization loops within a simulation input deck. The optimization of a two-s… Show more

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Cited by 9 publications
(4 citation statements)
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“…If this is not possible or too costly, for example for circuit timing simulations, then the models should incorporate the variations in the physical parameters. At this step, the physical parameters, such as width and height, will likely be correlated, and hence necessary computational methods such as principal component analysis [9] or alternatives [10] should be implemented in order to reduce or eliminate the inaccuracies caused by correlation between parameters.…”
Section: Interconnect Variationsmentioning
confidence: 99%
“…If this is not possible or too costly, for example for circuit timing simulations, then the models should incorporate the variations in the physical parameters. At this step, the physical parameters, such as width and height, will likely be correlated, and hence necessary computational methods such as principal component analysis [9] or alternatives [10] should be implemented in order to reduce or eliminate the inaccuracies caused by correlation between parameters.…”
Section: Interconnect Variationsmentioning
confidence: 99%
“…There are many papers such as [2][3][4][5] describing statistical modeling published in the last two decades. The paper [2] uses on-wafer process parametric test (E-test) [7] parameters for finding corner device specifications.…”
Section: Introductionmentioning
confidence: 99%
“…The paper [2] uses on-wafer process parametric test (E-test) [7] parameters for finding corner device specifications. The papers [3] and [4] focused on model parameter yields. The paper [5] developed new methods to define boundary models.…”
Section: Introductionmentioning
confidence: 99%
“…Subsequent yield improvement techniques move the circuit parameters from an initial configuration toward a new point which maximizes some figure of merit (e.g., the distance from the point to the acceptability region border or its approximation [12]- [15]). Yield improvement is an optimization problem and is solved with linear programming techniques (see [18] for a review) or with gradient descent-based techniques [12]- [15], [19].…”
Section: Introductionmentioning
confidence: 99%