Static and Transient Thermal Behavior of High Power Semiconductor Lasers

Zhenbang, 袁振邦 Yuan; Jingwei, 王警卫 Wang; Di, 吴迪 Wu; Xu, 陈旭 Chen; Xingsheng, 刘兴胜 Liu

doi:10.3788/cjl20093608.1957

Cited by 2 publications

(1 citation statement)

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“…For the conventional single-bar CS-packaged high power semiconductor laser arrays, the indium has been adopted generally as the solder joint medium, by which the laser bar is attached to a mounting heat-sink directly, due to its excellent material properties in ductility, thermal conductivity and wettability. But it is also the intrinsic material properties of indium solder that makes the conventional CS-packaging process has several drawbacks, which have been extensively studied, including various failure mechanisms associated with the electro-migration and the electro-thermal migration of the solder layer under the operation of high current, the thermal resistance of the device increasing due to indium is easily oxidized in high-and low-temperature, damp environment, and other harsh environment [7][8][9]11]. All of these influence the lifetime and reliability of devices seriously.…”

Section: Introductionmentioning

confidence: 99%

Thermal modeling and analysis of high power semiconductor laser arrays

Zhi-yong

Zhang

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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With the continuous increase of the output power of semiconductor laser array, the heat generation in the active region also increases continuously, which influences the performances and lifetime of semiconductor laser array seriously. In order to improve the performances and lifetime, understanding of the thermal behavior of high power semiconductor laser array packages and optimizing the thermal performance are crucial. By means of numerical analysis, a three-dimensional thermal model has been established, and the static and transient thermal characteristics in continuous-wave (CW) and quasi-continuous-wave (QCW) modes also have been studied systematically for a hard solder, conduction-cooled-packaged 808nm semiconductor laser array. Based on the thermal modeling and analysis, the approaches to reduce thermal resistance have been proposed. The results show that: compared with copper-tungsten (CuW), adopting the copper-diamond composite material as the submount can decrease the thermal crosstalk behavior between emitters, and reduce the thermal resistance by about 30%. In addition, a novel thermal design for the packaging structure of the mounting heat-sink is demonstrated, which has the ability of reducing the thermal resistance of the devices significantly.

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Section: Introductionmentioning

confidence: 99%